ASPM34 datasheet(13/16 Pages) ONSEMI

13 / 16 page

NFVA25012NP2T

www.onsemi.com

Figure 13. Typical Application Circuit

NOTES:

15.To avoid malfunction, the wiring of each input should be as short as possible (less than 2 − 3 cm).

16.VFO output is an open−drain type. This signal line should be pulled up to the positive side of the MCU or control power supply with a resistor

that makes IFO up to 2 mA. Please refer to Figure 13.

17.Fault out pulse width can be adjust by capacitor C5 connected to the CFOD terminal.

18.Input signal is active−HIGH type. There is a 5 kW resistor inside the IC to pull−down each input signal line to GND. RC coupling circuits

should be adopted for the prevention of input signal oscillation. R1C1 time constant should be selected in the range 50~ 50 ns

(recommended R1 = 100 W, C1 = 1 nF).

19.Each wiring pattern inductance of point A should be minimized (recommend less than 10 nH). Use the shunt resistor R4 of surface mounted

(SMD) type to reduce wiring inductance. To prevent malfunction, wiring of point E should be connected to the terminal of the shunt resistor

R4 as close as possible.

20.To insert the shunt resistor to measure each phase current at NU, NV, NW terminal, it makes to change the trip level ISC about the

short−circuit current.

21.To prevent errors of the protection function, the wiring of points B, C, and D should be as short as possible. The wiring of B between CSC

filter and RSC terminal should be divided at the point that is close to the terminal of sense resistor R5.

22.For stable protection function, use the sense resistor R5 with resistance variation within 1% and low inductance value.

23.In the short−circuit protection circuit, select the R6C6 time constant in the range 1.0~1.5 ms. R6 should be selected with a minimum of

10 times larger resistance than sense resistor R5. Do enough evaluaiton on the real system because short−circuit protection time may

vary wiring pattern layout and value of the R6C6 time constant.

24.Each capacitor should be mounted as close to the pins of the ASPM34 product as possible.

25.To prevent surge destruction, the wiring between the smoothing capacitor C7 and the P & GND pins should be as short as possible. The

use of a high−frequency non−inductive capacitor of around 0.1~0.22 mF between the P & GND pins is recommended.

26.Relays are used in most systems of electrical equipments in industrial application. In these cases, there should be sufficient distance

between the MCU and the relays.

27.The Zener diode or transient voltage suppressor should be adapted for the protection of ICs from the surge destruction between each pair

of control supply terminals (recommended Zener diode is 22 V / 1 W, which has the lower Zener impedance characteristic than about 15 W).

28.C2 of around seven times larger than bootstrap capacitor C3 is recommended.

29.Please choose the electrolytic capacitor with good temperature characteristic in C3. Choose 0.1~0.2 mF R−category ceramic capacitors

with good temperature and frequency characteristics in C4.

Fault

VDC

Gating UH

Gating VH

Gating WH

Gating WL

Gating VL

Gating UL

W−Phase Current

V−Phase Current

U−Phase Current

C1 C1 C1

5V line

LVIC

COM

VDD

VFO

CSC

OUT

W (2)

P (1)

(24) V S(U)

(23) V B(U)

(29) V S(V)

(28) V B(V)

(17) C SC

(15) V FO

(14) IN (WL)

(13) IN (VL)

(12) IN (UL)

HVIC

OUT

(25) IN (VH)

(10) V DD(L)

(19) IN (UH)

(34) V S(W)

(33) V B(W)

(21) V DD(UH)

(30) IN (WH)

Thermistor

(11) COM (L)

VDD

COM

CFOD

NU (7)

NV (6)

NW (5)

U (4)

V (3)

(8) R TH

(9) V TH

(16) C FOD

RSC (18)

(20) COM (H)

(22) V BD(U)

(26) V DD(VH)

(27) V BD(V)

(31) V DD(WH)

(32) V BD(W)

HVIC

OUT

VDD

COM

HVIC

OUT

VDD

COM

15V line

5V line

Temp.

Monitoring

Sense

Resistor

Shunt

Resistor

Control

GND Line

Power

GND Line

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