Panasonic Corporation Electromechanical Control Business Division

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Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Light Touch Switches/EVPAS

180

260

MAX.

150

230

90±30

40±10

(Normal Temp.)

Soldering Time (s)

Fan or Normal Temp.

Part No.

Height

AB

W

F

E

EVPAS

5.0

6.8±0.2

7.7±0.2

12.0±0.3

5.5±0.1 1.75±0.10 8.0±0.1

2.0±0.1

4.0±0.1

1.5

+0.1

0.4±0.1 5.25±0.20

Unit: mm

–0

■ Recommended Reflow Soldering Conditions

A

Feeding hole

Chip component

Tape running direction

Chip pocket

Tape width=12.0 mm

● Embossed Carrier Taping

Taping condition : Lack of products in the middle of taping should be

one MAX, but total quantity specified in the

specifications should be secured.

Peeling off strength of top tape : It should be within 0.2N to 1.0N at

165 degree in peeling off angle.

Joint of carrier tape : One joint per one reel may exist.

ANCTB38E 201912

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