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AXF5D3012 数据表(PDF) 2 Page - Panasonic Semiconductor

部件名 AXF5D3012
功能描述  Automation Controls Catalog
PDF  10 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  PANASONIC [Panasonic Semiconductor]
网页  http://www.panasonic.com/industrial/
标志 PANASONIC - Panasonic Semiconductor

AXF5D3012 数据表(HTML) 2 Page - Panasonic Semiconductor

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High current connectors
A35UH (0.35mm pitch)
–2–
ACCTB100E 201803-T
PRODUCT TYPES
Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Mated height
Number of pins
Part number
Packing
Socket
Header
Inner carton (1-reel)
Outer carton
0.6mm
10
AXF5D1012
AXF6D1012
15,000 pieces
30,000 pieces
12
AXF5D1212
AXF6D1212
16
AXF5D1612
AXF6D1612
20
AXF5D2012
AXF6D2012
24
AXF5D2412
AXF6D2412
30
AXF5D3012
AXF6D3012
34
AXF5D3412
AXF6D3412
40
AXF5D4012
AXF6D4012
44
AXF5D4412
AXF6D4412
50
AXF5D5012
AXF6D5012
54
AXF5D5412
AXF6D5412
60
AXF5D6012
AXF6D6012
70
AXF5D7012
AXF6D7012
Item
Specifications
Conditions
Electrical
characteristics
Rated
current
Power contact
5.0A/pin contact
Signal contact
0.3A/pin contact (Max. 5 A at total pin contacts)
Rated voltage
30V AC/DC
Dielectric strength
150V AC for 1 min.
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Insulation resistance
Min. 1,000M
Ω (initial)
Using 250V DC megger (applied for 1 min.)
Contact resistance
Max. 30m
Ω (power terminal)
Max. 90m
Ω (signal terminal)
Based on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force
1.300N/pin contact
× pin contacts
Composite removal force
0.165N/pin contact
× pin contacts
Environmental
characteristics
Ambient temperature
–55 to +85
°C
No icing. No condensation.
Soldering heat resistance
The initial specification must be satisfied electrically
and mechanically
Reflow soldering:
Peak temperature: 260
°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300
°C within 5 sec., 350°C within 3 sec.
Storage temperature
–55 to +85
°C (product only)
–40 to +50
°C (emboss packing)
No icing. No condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100M
Ω,
contact resistance max. 30m
Ω (power terminal)
max. 90m
Ω (signal terminal)
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100M
Ω,
contact resistance max. 30m
Ω (power terminal)
max. 90m
Ω (signal terminal)
Conformed to IEC60068-2-78
Temperature 40
±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100M
Ω,
contact resistance max. 30m
Ω (power terminal)
max. 90m
Ω (signal terminal)
Conformed to IEC60068-2-11
Temperature 35
±2°C, saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 30m
Ω (power terminal)
max. 90m
Ω (signal terminal)
Temperature 40
±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life
30 times
Repeated insertion and removal speed of max. 200 times/
hours
Unit weight
60 pins Socket: 0.02g Header: 0.01g
Order Temperature (
°C)
Time (minutes)
1
2
3
4
–55
85
–55
0
−3
30
Max. 5
30
Max. 5
+3
0
0
−3



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