Notes on Using Narrow pitch Connectors/High Current Connectors

–2–

ACCTB48E 201803-T

Regarding the selection of the connector placement machine and the mounting

procedures

Regarding soldering

Reflow soldering

Hand soldering

1) Select the placement machine taking into consideration the

connector height, required positioning accuracy, and packaging

conditions.

2) Be aware that if the chucking force of the placement machine

is too great, it may deform the shape of the connector body or

connector terminals.

3) Be aware that during mounting, external forces may be

applied to the connector contact surfaces and terminals and

cause deformations.

4) Depending on the size of the connector being used, self

alignment may not be possible. In such cases, be sure to

carefully position the terminal with the PC board pattern.

5) The positioning bosses give an approximate alignment for

positioning on the PC board. For accurate positioning of the

connector when mounting it to the PC board, we recommend

using an automatic positioning machine.

6) In case of dry condition, please note the occurrence of static

electricity. The product may be adhered to the embossed carrier

tape or the cover tape in dry condition. Recommended humidity

is from 40 to 60%RH and please remove static electricity by

ionizer in manufacturing process.

1) Measure the recommended profile temperature for reflow

soldering by placing a sensor on the PC board near the

connector surface or terminals. (Please refer to the specification

for detail because the temperature setting differs by products.)

2) As for cream solder printing, screen printing is recommended.

3) When setting the screen opening area and PC board foot

pattern area, refer the recommended PC board pattern and

window size of metal mask on the specification sheet, and make

sure that the size of board pattern and metal mask at the base of

the terminals are not increased.

4) Please pay attentions not to provide too much solder. It

makes miss mating because of interference at soldering portion

when mating.

5) When mounting on both sides of the PC board and the

connector is mounting on the underside, use adhesives or other

means to ensure the connector is properly fixed to the PC board.

(Double reflow soldering on the same side is possible.)

6) The condition of solder or flux rise and wettability varies

depending on the type of solder and flux. Solder and flux

characteristics should be taken into consideration and also set

the reflow temperature and oxygen level.

7) Do not use resin-containing solder. Otherwise, the contacts

might be firmly fixed.

8) Soldering conditions

Please use the reflow temperature profile conditions

recommended below for reflow soldering. Please contact our

sales office before using a temperature profile other than that

described below (e.g. lead-free solder)

For products other than the ones above, please refer to the

latest product specifications.

9) The temperature profiles given in this catalog are values

measured when using the connector on a resin-based PC

board. When performed reflow soldering on a metal board (iron,

aluminum, etc.) or a metal table to mount on a FPC, make sure

there is no deformation or discoloration of the connector before

mounting.

10) Please contact our sales office when using a screen-printing

thickness other than that recommended.

Terminal

Paste solder

PC board foot pattern

60 to 120 sec.

Preheating

Time

Temperature

Peak temperature

200℃

220℃

260℃

230℃

180℃

150℃

Peak temperature

70 sec.

25 sec.

Upper limited

(Solder heat resistance)

Lower limited

(Solder wettability)

1) Set the soldering iron so that the tip temperature is less than

that given in the table below.

Table A

2) Do not allow flux to spread onto the connector leads or PC

board. This may lead to flux rising up to the connector inside.

3) Touch the soldering iron to the foot pattern. After the foot

pattern and connector terminal are heated, apply the solder wire

so it melts at the end of the connector terminals.

4) Be aware that soldering while applying a load on the

connector terminals may cause improper operation of the

connector.

5) Thoroughly clean the soldering iron.

6) Flux from the solder wire may get on the contact surfaces

during soldering operations. After soldering, carefully check the

contact surfaces and clean off any solder before use.

7) These connector is low profile type. If too much solder is

supplied for hand soldering, It makes miss mating because of

interference at soldering portion. Please pay attentions.

Product name

Soldering iron temperature

SMD type connectors all products

300

°C within 5 sec.

350

°C within 3 sec.

Apply the solder

wire here

Terminal

Pattern

Small angle as

possible up to

45 degrees

PC board