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STM32G474PBY3TR 数据表(PDF) 202 Page - STMicroelectronics |
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STM32G474PBY3TR 数据表(HTML) 202 Page - STMicroelectronics |
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202 / 236 page ![]() Package information STM32G474xB STM32G474xC STM32G474xE 202/236 DS12288 Rev 5 Figure 55. WLCSP81 - recommended footprint Table 111. WLCSP81 - mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 3 decimal digits. Min Typ Max Min Typ Max A(2) 2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal and tolerances values of A1 and A2. - - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3 - 0.025 - - 0.001 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 4.00 4.02 4.04 0.157 0.158 0.159 E 4.25 4.27 4.29 0.167 0.168 0.169 e - 0.40 - - 0.016 - e1 - 3.20 - - 0.126 - e2 - 3.20 - - 0.126 - F(3) 3. Calculated dimensions are rounded to the 3rd decimal place - 0.410 - - 0.016 - G(3) - 0.535 - - 0.021 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 B068_WLCSP81_DIE469_FP_V1 Dpad Dsm |
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