ZSC31150 Datasheet

© 2016 Integrated Device Technology, Inc.

2

December 6, 2016

PGA

TS

ADC

CMC

ROM

RAM

EEPROM

DAC

BAMP

ZACwire™

Analog Block

Digital Block

ZSC31150

Digital

Data I/O

Analog

Out

ZSC31150

Block Diagram

Ordering Information

Sales Code

Description

Package

ZSC31150GE

ZSC31150 Die – Temperature range: -40°C to +150°C

Unsawn on Wafer: add “B” to sales code

Sawn on Wafer Frame: add “C”

Waffle Pack: add “D”

ZSC31150GEG2-R

ZSC31150 14-DFN (5

 4 mm; wettable flanks) – Temperature

range: -40°C to 150°C

Tape and Reel

ZSC31150GAG2-R

ZSC31150 14-DFN (5

 4 mm; wettable flanks) – Temperature

range: -40°C to 125°C

Tape and Reel

ZSC31150GAB

ZSC31150 Die – Temperature range: -40°C to +125°C

Unsawn on Wafer

ZSC31150GAC

ZSC31150 Die – Temperature range: -40°C to +125°C

Sawn on Wafer Frame

ZSC31150GEG1

ZSC31150 14-SSOP – Temperature range: -40°C to +150°C

Tube: add “-T” to sales code

Tape & Reel: add “-R”

ZSC31150GLG1

ZSC31150 14-SSOP – Temperature range: -40°C to +150°C

(Long life: 5000h @150°C)

ZSC31150GAG1

ZSC31150 14-SSOP – Temperature range: -40°C to +125°C

ZSC31150KITV1P2

ZSC31150 SSC Evaluation Kit V1.2: Three interconnecting boards, five ZSC31150 SSOP14 samples, USB cable

(software can be downloaded from product page at www.IDT.com/ZSC31150)

ZSC31150MCSV1P1

Modular Mass Calibration System (MSC) V1.1 for ZSC31150: MCS boards, cable, connectors (software can be

downloaded from product page)