F2270 Datasheet

© 2019 Integrated Device Technology, Inc.

9

January 16, 2019

Thermal Characteristics

Table 7.

Package Thermal Characteristics

Parameter

Symbol

Value

Units

Junction to Ambient Thermal Resistance

80.6

°C/W

Junction to Case Thermal Resistance

(case is defined as the exposed paddle)

5.1

°C/W

Moisture Sensitivity Rating (Per J-STD-020)

MSL 1

Typical Operating Conditions (TOCs)

Unless otherwise noted:









RF trace and connector losses removed for insertion loss and attenuation results. All other results include the PCB trace and connector

losses and mismatched effects.







Two tone frequency spacing









All temperatures are referenced to the exposed paddle.



Extended band tuning uses L1 = 2.4nH and L2 = 2.8nH to improve RF1 and RF2 port match.