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TMS320F28375DPZP 数据表(PDF) 39 Page - Texas Instruments

部件名 TMS320F28375DPZP
功能描述  TMS320F2837xD Dual-Core Microcontrollers
PDF  226 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TMS320F28375DPZP 数据表(HTML) 39 Page - Texas Instruments

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TERMINAL
I/O/Z
(1)
DESCRIPTION
NAME
MUX
POSITION
ZWT
BALL
NO.
PTP
PIN
NO.
PZP
PIN
NO.
VSS
L10
PWR
PAD
PWR
PAD
Device ground. For Quad Flatpacks (QFPs), the
PowerPAD on the bottom of the package must be
soldered to the ground plane of the PCB.
L11
L12
L18
M8
M9
M10
M11
M12
M14
M15
N1
N5
N6
P7
P8
P11
P12
P14
P15
R7
R8
R14
R15
W7
W19
VSSOSC
H18
122
67
Crystal oscillator (X1 and X2) ground pin. When using an
external crystal, do not connect this pin to the board
ground. Instead, connect it to the ground reference of the
external crystal oscillator circuit.
If an external crystal is not used, this pin may be
connected to the board ground.
H19
–
–
VSSA
P1
34
17
Analog ground.
On the PZP package, pin 17 is double-bonded to VSSA
and VREFLOA. This pin must be connect to VSSA.
P5
52
35
R5
–
36
V7
–
–
W1
–
–
SPECIAL FUNCTIONS
ERRORSTS
U19
92
–
O
Error status output. This pin has an internal pulldown.
TEST PINS
FLT1
W12
73
42
I/O
Flash test pin 1. Reserved for TI. Must be left
unconnected.
FLT2
V13
74
43
I/O
Flash test pin 2. Reserved for TI. Must be left
unconnected.
(1)
I = Input, O = Output, OD = Open Drain, Z = High Impedance
www.ti.com
TMS320F28379D, TMS320F28379D-Q1, TMS320F28378D, TMS320F28377D
TMS320F28377D-Q1, TMS320F28376D, TMS320F28375D, TMS320F28374D
SPRS880O – DECEMBER 2013 – REVISED FEBRUARY 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
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Product Folder Links: TMS320F28379D TMS320F28379D-Q1 TMS320F28378D TMS320F28377D
TMS320F28377D-Q1 TMS320F28376D TMS320F28375D TMS320F28374D



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