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LT8253EUFDM 数据表(PDF) 14 Page - Analog Devices

部件名 LT8253EUFDM
功能描述  40V USB Type-C Power Delivery Buck-Boost Controller
PDF  20 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

LT8253EUFDM 数据表(HTML) 14 Page - Analog Devices

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LT8253/LT8253A
14
Rev. 0
For more information www.analog.com
APPLICATIONS INFORMATION
The LT8253/LT8253A use the VIN/VOUT ratio to transition
between modes and regions. Bigger IR drop in the power
path caused by improper MOSFET and inductor selection
may prevent the LT8253/LT8253A from smooth transi-
tion. To ensure smooth transitions between buck, buck-
boost, and boost modes of operation, choose low RDS(ON)
MOSFETs and low DCR inductor to satisfy:
IOUT(MAX)
0.025 • VOUT
RA,B +RC,D +RSENSE +RL
where:
RA,B isthemaximumRDS(ON) ofMOSFETsAorBat25°C
RC,D isthemaximumRDS(ON) ofMOSFETsCorDat25°C
RL is the maximum DCR resistor of inductor at 25°C
The RDS(ON) and DCR increase at higher junction
temperatures and the process variation have been
included in the calculation above.
In order to select the power MOSFETs, the power dis-
sipated by the device must be known. For switch A, the
maximum power dissipation happens in boost region,
when it remains on all the time. Its maximum power dis-
sipation at maximum output current is given by:
PA(BOOST) =
IOUT(MAX) • VOUT
VIN
÷
2
T • RDS(ON)
where
ρT is a normalization factor (unity at 25°C) ac-
counting for the significant variation in on-resistance with
temperature, typically 0.4%/°C as shown in Figure 7. For
a maximum junction temperature of 125°C, using a value
of
ρT = 1.5 is reasonable.
Switch B operates in buck region as the synchronous
rectifier. Its power dissipation at maximum output cur-
rent is given by:
PB(BUCK) =
VIN � VOUT
VIN
• IOUT(MAX)
2 • �T •RDS(ON)
Switch C operates in boost region as the control switch.
Its power dissipation at maximum current is given by:
PC(BOOST) =
VOUT � VIN
(
) • VOUT
VIN
2
• IOUT(MAX)
2 • �T
• RDS(ON) + k • VOUT
3
IOUT(MAX)
VIN
• CRSS • f
JUNCTION TEMPERATURE (°C)
–50
1.0
1.5
150
8253A F07
0.5
0
0
50
100
2.0
Figure 7. Normalized RDS(ON) vs Temperature
where CRSS is usually specified by the MOSFET manufac-
turers. The constant k, which accounts for the loss caused
by reverse recovery current, is inversely proportional to
the gate drive current and has an empirical value of 1.7.
For switch D, the maximum power dissipation happens in
boost region, when its duty cycle is higher than 50%. Its
maximum power dissipation at maximum output current
is given by:
PD(BOOST) =
VOUT
VIN
• IOUT(MAX)
2 • �T •RDS(ON)
For the same output voltage and current, switch A has the
highest power dissipation and switch B has the lowest
power dissipation unless a short occurs at the output.
From a known power dissipated in the power MOSFET, its
junction temperature can be obtained using the following
formula:
TJ = TA + P • RTH(JA)
The junction-to-ambient thermal resistance RTH(JA)
includes the junction-to-case thermal resistance RTH(JC)
and the case-to-ambient thermal resistance RTH(CA). This
value of TJ can then be compared to the original, assumed
value used in the iterative calculation process.



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