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LT8253EUFDM 数据表(PDF) 14 Page - Analog Devices |
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LT8253EUFDM 数据表(HTML) 14 Page - Analog Devices |
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14 / 20 page ![]() LT8253/LT8253A 14 Rev. 0 For more information www.analog.com APPLICATIONS INFORMATION The LT8253/LT8253A use the VIN/VOUT ratio to transition between modes and regions. Bigger IR drop in the power path caused by improper MOSFET and inductor selection may prevent the LT8253/LT8253A from smooth transi- tion. To ensure smooth transitions between buck, buck- boost, and boost modes of operation, choose low RDS(ON) MOSFETs and low DCR inductor to satisfy: IOUT(MAX) � 0.025 • VOUT RA,B +RC,D +RSENSE +RL where: RA,B isthemaximumRDS(ON) ofMOSFETsAorBat25°C RC,D isthemaximumRDS(ON) ofMOSFETsCorDat25°C RL is the maximum DCR resistor of inductor at 25°C The RDS(ON) and DCR increase at higher junction temperatures and the process variation have been included in the calculation above. In order to select the power MOSFETs, the power dis- sipated by the device must be known. For switch A, the maximum power dissipation happens in boost region, when it remains on all the time. Its maximum power dis- sipation at maximum output current is given by: PA(BOOST) = IOUT(MAX) • VOUT VIN � � � � � ÷ 2 • �T • RDS(ON) where ρT is a normalization factor (unity at 25°C) ac- counting for the significant variation in on-resistance with temperature, typically 0.4%/°C as shown in Figure 7. For a maximum junction temperature of 125°C, using a value of ρT = 1.5 is reasonable. Switch B operates in buck region as the synchronous rectifier. Its power dissipation at maximum output cur- rent is given by: PB(BUCK) = VIN � VOUT VIN • IOUT(MAX) 2 • �T •RDS(ON) Switch C operates in boost region as the control switch. Its power dissipation at maximum current is given by: PC(BOOST) = VOUT � VIN ( ) • VOUT VIN 2 • IOUT(MAX) 2 • �T • RDS(ON) + k • VOUT 3 • IOUT(MAX) VIN • CRSS • f JUNCTION TEMPERATURE (°C) –50 1.0 1.5 150 8253A F07 0.5 0 0 50 100 2.0 Figure 7. Normalized RDS(ON) vs Temperature where CRSS is usually specified by the MOSFET manufac- turers. The constant k, which accounts for the loss caused by reverse recovery current, is inversely proportional to the gate drive current and has an empirical value of 1.7. For switch D, the maximum power dissipation happens in boost region, when its duty cycle is higher than 50%. Its maximum power dissipation at maximum output current is given by: PD(BOOST) = VOUT VIN • IOUT(MAX) 2 • �T •RDS(ON) For the same output voltage and current, switch A has the highest power dissipation and switch B has the lowest power dissipation unless a short occurs at the output. From a known power dissipated in the power MOSFET, its junction temperature can be obtained using the following formula: TJ = TA + P • RTH(JA) The junction-to-ambient thermal resistance RTH(JA) includes the junction-to-case thermal resistance RTH(JC) and the case-to-ambient thermal resistance RTH(CA). This value of TJ can then be compared to the original, assumed value used in the iterative calculation process. |
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