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M34E02 数据表(PDF) 22 Page - STMicroelectronics |
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M34E02 数据表(HTML) 22 Page - STMicroelectronics |
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22 / 23 page ![]() M34E02 22/23 REVISION HISTORY Table 16. Revision History Date Rev. Description of Revision 13-Nov-2003 1.0 First release 01-Dec-2003 1.1 TSSOP8 4.4x3 package replaces TSSOP8 3x3 (MSOP8) package. Correction to sentence in “Setting the Write Protection”. Correction to specification of tNS values. 29-Mar-2004 1.2 Always NoACK after Address and Data bytes in Table 6. Improvement in VIO and VCC (min) in Absolute Maximum Ratings table. IOL changed for test condition of VOL. MLP package mechanical data respecified. Soldering temperature information clarified for RoHS compliant devices. 14-Apr-2004 2.0 First public release 24-Nov-2004 3.0 Direct connection of E0, E1, E2 to VSS and VCC (see Chip Enable (E0, E1, E2) and USE WITHIN A DDR2 DIMM paragraphs). ZEiL and ZEiH parameters added to Table 10., Input Parameters. E0, E1, E2 removed from the Parameter descriptions of VIL and VIH in Table 11., DC Characteristics. Document status promoted from Product Preview to full Datasheet. |
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