Advanced CMOS TTL Input – 74ACT574

8-bit non-inverting D-Type Flip-Flop with 3-State Outputs in bare die form

Rev 1.0

19/3/2021

Die Size (Unsawn)

1450 x 1650

57 x 65

µm

mils

Minimum Bond Pad Size

108 x 108

4.25 x 4.25

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si



Outputs Source/Sink 24 mA



Low Input Current: 1µA



TTL / CMOS compatible Input Levels



Outputs directly interface CMOS, NMOS and TTL



Operating Voltage Range: 4.5V to 5.5V



Function compatible with74LS574



Full Military Temperature Range.

Features:

Ordering Information

The following part suffixes apply:



No suffix - MIL-STD-883 /2010B Visual Inspection

For High Reliability versions of this product please see

54ACT574

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (100 per tray capacity)



Sawn Wafer on Tape – On request



Unsawn Wafer – On request



Die Thickness <> 350µm(14 Mils) – On request



Assembled into Ceramic Package – On request

The 74ACT574 is fabricated using a 1.5µm 5V CMOS

process combining high speed performance LSTTL

performance with CMOS low power consumption. The

device integrates eight D-type Flip-Flops, a buffered

common Clock (CLK) and a buffered common Output

Enable (OE). The information presented to the D-type

inputs is stored in the flip-flops on the LOW-to-HIGH Clock

(CLK) transition. Device inputs directly accept both

standard CMOS and LSTTL outputs. All inputs are

equipped with protection circuits against static discharge

and transient excess voltage.

Description

Die Dimensions in µm (mils)

1450 (57)

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