ADRF5019

Data Sheet

Rev. 0 | Page 12 of 12

OUTLINE DIMENSIONS

Figure 25. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.85 mm Package Height

(CP-16-38)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Marking Code

ADRF5019BCPZN

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-38

S4Z

ADRF5019BCPZN-R7

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-38

S4Z

ADRF5019-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

3.10

3.00 SQ

2.90

0.30

0.25

0.20

1.92

1.70 SQ

1.48

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

*0.35

0.30

0.25

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

0.95

0.85

0.75

*COMPLIANT WITH JEDEC STANDARDS MO-220-VEED-4

WITH THE EXCEPTION OF PACKAGE EDGE TO LEAD EDGE.

SEATING

PLANE

SIDE VIEW

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDICATOR

AREA

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registered trademarks are the property of their respective owners.

D21247-0-8/19(0)