LSM6DSO32X datasheet(2/162 Pages) STMICROELECTRONICS

2 / 162 page

The LSM6DSO32X supports main OS requirements, offering real, virtual and batch

sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor

modules leverages the robust and mature manufacturing processes already used

for the production of micromachined accelerometers and gyroscopes. The various

sensing elements are manufactured using specialized micromachining processes,

while the IC interfaces are developed using CMOS technology that allows the design

of a dedicated circuit which is trimmed to better match the characteristics of the

sensing element.

The LSM6DSO32X embeds a dedicated core for Machine Learning processing

(MLC) and a Finite State Machine (FSM) that provides system flexibility, allowing

some algorithms run in the application processor to be moved to the MEMS sensor

with the advantage of consistent reduction in power consumption.

The LSM6DSO32X has a full-scale acceleration range of ±4/±8/±16/±32 g and an

angular rate range of ±125/±250/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DSO32X the preferred choice

of system designers for the creation and manufacturing of reliable products. The

LSM6DSO32X is available in a plastic land grid array (LGA) package.

LSM6DSO32X

DS13607 - Rev 1

page 2/162

LSM6DSO32X 数据表(PDF) 2 Page - STMicroelectronics