Data Sheet

ADMV1012

Rev. A | Page 5 of 19

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

24 NIC

23 NIC

22 IF1

21 NIC

20 IF2

19 NIC

18 NIC

17 NIC

1

2

3

4

5

6

7

8

NIC

GND

RFIN

GND

NIC

NIC

NIC

NIC

ADMV1012

TOP VIEW

(Not to Scale)

NOTES

1. NIC = NOT INTERNALLY CONNECTED. IT IS

RECOMMENDED TO GROUND THESE PINS

ON THE PCB.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE

CONNECTED TO GND. GOOD RF AND THERMAL

GROUNDING IS RECOMMENDED.

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 5 to 9, 12 to 14, 16 to 19,

21, 23 to 26, 28 to 30, 32

NIC

Not Internally Connected. It is recommended to ground these pins on the PCB.

2, 4, 11

GND

Ground.

3

RFIN

RF Input. This pin is ac-coupled internally and matched to 50 Ω single ended.

10

LOIN

LO Input. This pin is ac-coupled internally and matched to 50 Ω single ended.

15

VDLO

Power Supply Voltage for the LO Amplifier. Refer to the Applications Information section for the

required external components and biasing.

20, 22

IF2, IF1

Quadrature IF Outputs. Matched to 50 Ω and ac coupled. No external dc block is required.

27

VDRF

Power Supply Voltage for the RF Amplifier. Refer to the Applications Information section for the

required external components and biasing.

31

VGRF

Power Supply Gate Voltage for the RF Amplifier. Refer to the Applications Information section for

the required external components and biasing.

EPAD

Exposed Pad. The exposed pad must be connected to GND. Good RF and thermal grounding is

recommended.