ADMV1012

Data Sheet

Rev. A | Page 16 of 19

EVALUATION BOARD INFORMATION

The circuit board used in the application must use RF circuit

design techniques. Signal lines must have 50 Ω impedance, and

the package ground leads and exposed pad must be connected

directly to the ground plane similarly to that shown in Figure 35

and Figure 36. Use a sufficient number of via holes to connect

the top and bottom ground planes. The evaluation circuit board

shown in Figure 34 is available from Analog Devices upon request.

Layout

Solder the exposed pad on the underside of the ADMV1012 to

a low thermal and electrical impedance ground plane. This pad

is typically soldered to an exposed opening in the solder mask

on the evaluation board. Connect these ground vias to all other

ground layers on the evaluation board to maximize heat

dissipation from the device package. Figure 35 shows the PCB

land pattern footprint for the ADMV1012-EVALZ, and Figure 36

shows the solder paste stencil for the ADMV1012-EVALZ

evaluation board.

Power-On Sequence

To set up the ADMV1012-EVALZ, take the following steps:

1. Power up the VGRF with a −1.8 V supply.

2. Power up the VDRF with a 3 V supply.

3. Power up the VDLO with a 3 V supply.

4. Adjust the VGRF supply between −1.8 V to −0.4 V until

IDRF = 68 mA.

5. Connect LOIN to the LO signal generator with an LO

power of between −4 dBm to +4 dBm.

6. For the upper sideband, add a 50 Ω termination to the

IF_OUTPUT_LSB connector. For the lower sideband, add

a 50 Ω termination to the IF_OUTPUT_USB connector.

7. Apply a RF signal to the RF_INPUT and LO_INPUT ports.

Power-Off Sequence

To turn off the ADMV1012-EVALZ, take the following steps:

1. Turn off the LO and RF signals.

2. Set VGRF to −1.8 V.

3. Set the VDRF supply to 0 V and then turn off the VDRF

supply.

4. Set the VDLO supply to 0 V and then turn off the VDLO

supply.

5. Turn off the VGRF supply.

0.138" SQUARE MASK OPENING

0.02 × 45° CHAMFER FOR PIN 1

0.197"

[0.50]

PAD SIZE

0.026" × 0.010"

0.217" SQUARE

0.004" MASK/METAL OVERLAP

0.010" MINIMUM MASK WIDTH

0.010" REF

0.030"

MASK OPENING

0.156"

MASK

OPENING

PIN 1

GROUND PAD

SOLDER MASK

0.146" SQUARE

GROUND PAD

ø.010"

TYPICAL VIA

ø.034"

TYPICAL

VIA SPACING

Figure 35. PCB Land Pattern Footprint of the ADMV1012-EVALZ