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STTH1004 数据表(PDF) 3 Page - STMicroelectronics |
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STTH1004 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 7 page ![]() STTH1004 Characteristics 3/7 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus dIF/dt (typical values) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Z th(j-c)/Rth(j-c) Single pulse TO-220FPAC tP(s) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 0 50 100 150 200 250 300 350 400 450 500 I F=IF(AV) V R=200V T j=125°C I (A) RM dI /dt(A/µs) F Figure 5. Reverse recovery time versus dIF/dt (typical values) Figure 6. Reverse recovery charges versus dIF/dt (typical values) 0 10 20 30 40 50 60 70 80 0 50 100 150 200 250 300 350 400 450 500 I F=IF(AV) V R=200V T j=125°C t (ns) rr dI /dt(A/µs) F 0 50 100 150 200 250 300 0 50 100 150 200 250 300 350 400 450 500 Q RR(nC) I F=IF(AV) V R=200V Tj=125°C dI /dt(A/µs) F Figure 7. Reverse recovery softness factor versus dIF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 50 100 150 200 250 300 350 400 450 500 I F < 2 x IF(AV) V R=200V T j=125°C S factor dI /dt(A/µs) F 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 25 50 75 100 125 T (°C) j |
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