REV. 0

AD10201

–12–

Solder Reflow Profile

The solder reflow profile provided in Figure 4 is recommended.

TIME – Seconds

0

50

100

250

200

150

050

100

150

200

250

300

350

400

Figure 4. Typical Solder Reflow Profile

LAYOUT INFORMATION

The schematic of the evaluation board (Figures 5a–5d) represents

a typical implementation of the AD10201. The pinout of the

AD10201 is very straightforward and facilitates ease of use and the

implementation of high-frequency/high resolution design practices.

It is recommended that high quality ceramic chip capacitors be used

to decouple each supply pin to ground directly at the device. All

capacitors can be standard high quality ceramic chip capacitors.

Care should be taken when placing the digital output runs. Because

the digital outputs have such a high slew rate, the capacitive loading

on the digital outputs should be minimized. Circuit traces for the

digital outputs should be kept short and connect directly to the

receiving gate. Internal circuitry buffers the outputs of the AD9432

ADC through a resistor network to eliminate the need to exter-

nally buffer the device from the receiving gate.

EVALUATION BOARD

The AD10201 evaluation board (Figures 6a–6f) is designed to

provide optimal performance for evaluation of the AD10201

analog-to-digital converter. The board encompasses everything

needed to ensure the highest level of performance for evaluating

the AD10201. The board requires an analog input signal, encode

clock, and power supply inputs. The clock is buffered on-board

to provide clocks for the latches. The digital outputs and out

clocks are available at the standard 40-pin connectors J1 and J2.

Power to the analog supply pins is connected via banana jacks.

The analog supply powers the associated components and the

analog section of the AD10201. The digital outputs of the

AD10201 are powered via banana jacks with 3.3 V. Contact the

factory if additional layout or applications assistance is required.

BILL OF MATERIALS LIST FOR AD10201 EVALUATION BOARD

Quantity

Reference Designator

Value

Description

Part Number

2

U16, U17

IC, Low Voltage 16-Bit D-Type Flip-Flop

74LCX16374MTD

with 5 V Tolerant Inputs and Outputs

(Fairchild)

1U1

IC, BGA 35

35 385

AD10201AB

2

U14, U15

IC, Precision Low Dropout any CAP

ADP3330ART-3.3-RL7

Voltage Regulator

(Analog)

4

R38, R39, R56, R58

33 k

Ω

RES 33 k

Ω 1/10W 0.1% 0805 SMD

ERA-6YEB333V (Panasonic)

8

R1, R7, R8, R41, R60, R61, R71, R72

51

Ω

RES 51

Ω 1/10W 5% 0805 SMD

ERJ-6GEYJ510V (Panasonic)

32

R3, R4, R9–R18, R23–R30, R35,

100

Ω

RES 100

Ω 1/10W 1% 0805 SMD

ERJ-6ENF1000V

R36, R40, R42–R46, R63–R66

(Panasonic)

23

C1, C2, C5–C10, C12, C16–C18,

0.1

µF

CAP 0.1

µF 50 V Ceramic Y5V 0805

ECJ-2VF1H104Z

C20–C26, C28, C33–C35

(Panasonic)

2

C13, C27

0.47

µF CAP 0.47 µF 25 V Ceramic Y5V 0805

ECJ-2YF1E474Z (Panasonic)

2

J1, J2

2

20 Male Connector Strip, 100 Centers

TSW-120-08G-D (Samtec)

4

L1, L2, L3, L4

47

Ω

SMT Ferrite Bead

2743019447 (Fair Rite)

4

U2, U3, U9, U11

IC, 3.3 V/5 V ECL Differential

MC10EP16D

Receiver/Driver

(Motorola)

8E3–E6, E25, E26, E33, E34

Power Jack, Banana Plug

108-0740-001 (Johnson Company)

2

U4, U10

3.3 V Dual Differential

SY100ELT23L

LVPECL-to-LVTTL Translator

(Micrel-Synergy)

10

C3, C4, C11, C14, C15, C19,

10

µF

Solid Tantalum Chip Capacitor,

T491C106M016AS

C29, C30–C32

10

µF, 16 V, 20%

(KEMET)

8J3–J7, J10–J12

SMA PLUG 200Mil STR GOLD

142-0801-201

(Johnson Components Inc.)

4

Spacer Aluminum, Hex M–F (Standoff)

4

Nut Hex Stl #4-40 UNC-2B

1

AD10201/AD10226 Evaluation Board

GS03983 Rev. A (PCB)

2

C36, C37

CAP 0.047

µF 25 V Ceramic Y5V 0603

ECJ-1VB1C473K

4

JP3, JP6, JP8, JP12

0

Ω

RES 0

Ω 1/16 W 5% 0402

ER J-2GEOR00