HMC329ALC3B

Data Sheet

Rev. 0 | Page 22 of 23

APPLICATIONS INFORMATION

TYPICAL APPLICATION CIRCUIT

Figure 73 shows the typical application circuit for the

HMC329ALC3B. The HMC329ALC3B is a passive device

and does not require any external components. The LO and RF

pins are internally ac-coupled. The IF pin is internally dc-coupled.

For applications not requiring operation to dc, dc block this

port externally using a series capacitor of a value chosen to pass

the necessary IF frequency range. When IF operation to dc is

required, do not exceed the IF source and sink current rating

specified in the Absolute Maximum Ratings section.

GND

GND

RF

GND

LO

LO

RF

IF

GND

HMC329ALC3B

1

7

8

9

10

11

12

4

2

3

5

6

Figure 73. Typical Application Circuit

EVALUATION PCB INFORMATION

Use RF circuit design techniques for the circuit board used in

the application. Ensure that signal lines have 50 Ω impedance

and connect the package ground leads and the exposed pad

directly to the ground plane (see Figure 74). Use a sufficient

number of via holes to connect the top and bottom ground

planes. The evaluation circuit board shown in Figure 74 is

available from Analog Devices, Inc., upon request.

Table 7. List of Materials for Evaluation PCB

EV1HMC329ALC3B

Item

Description

J1, J2

PCB mount, SRI, 2.92 mm connectors

J3

PCB mount, Johnson Components SMA connector

U1

HMC329ALC3B

117611-1 evaluation board on

Rogers Corporation RO4350B laminates

1

117611-1 is the raw bare PCB identifier. Reference EV1HMC329ALC3B when

ordering complete evaluation PCB.

J1

J3

IF

LO

RF

117611–1

U1

J2

329 A

Figure 74. Evaluation PCB Top Layer