Data Sheet

HMC329ALC3B

Rev. 0 | Page 23 of 23

OUTLINE DIMENSIONS

0.50

BSC

0.32

BSC

BOTTOM VIEW

TOP VIEW

SIDE VIEW

0.08

BSC

1

4

6

7

9

10

12

3

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.36

0.30

0.24

PIN 1

EXPOSED

PAD

PIN 1

INDICATOR

3.05

2.90 SQ

2.75

2.10 BSC

1.00 REF

1.60

1.50 SQ

1.40

0.90

0.80

0.70

SEATING

PLANE

Figure 75. 12-Terminal Ceramic Leadless Chip Carrier [LCC]

(E-12-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Moisture Sensitivity Level (MSL) Rating2

Package Description

Package

Option

HMC329ALC3B

−40°C to +85°C

MSL3

12-Terminal LCC

E-12-4

HMC329ALC3BTR

−40°C to +85°C

MSL3

12-Terminal LCC

E-12-4

HMC329ALC3BTR-R5

−40°C to +85°C

MSL3

12-Terminal LCC

E-12-4

EV1HMC329ALC3B

Evaluation PCB Assembly

1

The HMC554ALC3B, HMC554ALC3BTR, and HMC554ALC3BTR-R5 are RoHS compliant parts.

2

See Table 2 in the Absolute Maximum Ratings section.

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registered trademarks are the property of their respective owners.

D16676-0-5/18(0)