CBA

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Vishay Electro-Films

Revision: 02-May-13

2

Document Number: 61041

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

CONFIGURATIONS in inches

SCHEMATIC

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip Size

0.019" x 0.030" ± 0.002" (0.48 mm x 0.75 mm ± 0.05 mm)

Chip Thickness

0.010" ± 0.003" (0.25 mm ± 0.08 mm)

Chip Substrate Material

Semiconductor silicon

Dielectric

Silicon dioxide (MOS)

Bonding Pads

10 kÅ minimum aluminum

Backing

3 kÅ minimum gold

GLOBAL PART NUMBER INFORMATION

Global Part Number: CBA3750CMAHWS



Global Part Number Description: CBA 3.75 pF 20 % Al H WS

MODEL

CAPACITANCE

(pF)

CAPACITANCE

MULTIPLIER

CODE

TOLERANCE

CODE

TERMINATION

VISUAL

CLASS

PACKAGING

CODE

CBA

First 4 digits

are significant

figures of

capacitance

C = 0.001

B = 0.01

K = 10 %

M = 20 %

L = 25 %

G = Au

A = Al

H = Class H

K = Class K

WS = Waffle pack

100 min., 1 mult

0.008

0.030

0.0075

0.00375

0.004 0.004

0.015

0.019

0.004

TOP BONDING PADS

1.0 pF

2.0 pF

4.0 pF 8.0 pF

Back of chip

TOP BONDING PADS

0.25 pF 0.5 pF

1.0 pF 2.0 pF

Back of chip

75

0

C

M

A

B

C

3

AH

WS