HMC525ALC4TR-R5 datasheet(4/28 Pages) AD

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HMC525ALC4

Data Sheet

Rev. A | Page 4 of 28

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

RF Input Power

20 dBm

LO Input Power

25 dBm

IF Input Power

20 dBm

IF Source and Sink Current

2 mA

Reflow Temperature

260°C

Maximum Junction Temperature (TJ)

175°C

Lifetime at Maximum (TJ)

>1 × 106 hours

Moisture Sensitivity Level (MSL)1

Continuous Power Dissipation, PDISS (TA =

85°C, Derate 6.22 mW/°C Above 85°C)2

560 mW

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature Range

−65°C to +150°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

250 V

Field Induced Charged Device Model

(FICDM)

500 V

Based on IPC/JEDEC J-STD-20 MSL Classifications.

PDISS is a theoretical number calculated by (TJ − 85°C)/θJC.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any

other conditions above those indicated in the operational section of

this specification is not implied. Operation beyond the maximum

operating conditions for extended periods may affect product

reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

E-24-11

120

161

°C/W

See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance (PCB with 3 × 3 vias).

ESD CAUTION

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