MCP661 datasheet(5/68 Pages) MICROCHIP

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 2009-2014 Microchip Technology Inc.

DS20002194E-page 5

MCP660/1/2/3/4/5/9

DIGITAL ELECTRICAL SPECIFICATIONS

Electrical Characteristics: Unless indicated, TA =+25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM =VDD/2,

VOUT  VDD/2, VL =VDD/2, RL =1 k to VL, CL = 20 pF and CS =VSS (refer to Figures 1-1 and 2-1).

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

CS Low Specifications

CS Logic Threshold, Low

VIL

VSS

—0.2VDD

CS Input Current, Low

ICSL

—

-0.1

—

CS =0V

CS High Specifications

CS Logic Threshold, High

VIH

0.8VDD

—VDD

CS Input Current, High

ICSH

—-0.7

—

µA

CS =VDD

GND Current

ISS

-2

-1

—µA

CS Internal Pull-Down Resistor

RPD

—5

—



Amplifier Output Leakage

IO(LEAK)

—40

—

CS =VDD, TA = +125°C

CS Dynamic Specifications

CS Input Hysteresis

VHYST

—

0.25

—

CS High to Amplifier Off Time

(output goes High Z)

tOFF

—

200

—

G = +1 V/V, VL =VSS

CS =0.8VDD to VOUT =0.1(VDD/2)

CS Low to Amplifier On Time

tON

—2

µs

G = +1 V/V, VL =VSS

CS =0.2VDD to VOUT =0.9(VDD/2)

TEMPERATURE SPECIFICATIONS

Electrical Characteristics: Unless otherwise indicated, all limits are specified for VDD = +2.5V to +5.5V, VSS = GND.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Specified Temperature Range

-40

—

+125

°C

Operating Temperature Range

-40

—

+125

°C

Note 1

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, 5L-SOT-23

θJA

—201.0

—

°C/W

Thermal Resistance, 6L-SOT-23

θJA

—

190.5

—

°C/W

Thermal Resistance, 8L-3x3 DFN

θJA

—

56.7

—

°C/W Note 2

Thermal Resistance, 8L-MSOP

θJA

—211

—

°C/W

Thermal Resistance, 8L-SOIC

θJA

—

149.5

—

°C/W

Thermal Resistance, 8L-2x3 TDFN

θJA

—

52.5

—

°C/W

Thermal Resistance, 10L-3x3 DFN

θJA

—

54.0

—

°C/W Note 2

Thermal Resistance, 10L-MSOP

θJA

—202

—

°C/W

Thermal Resistance, 14L-SOIC

θJA

—

90.8

—

°C/W

Thermal Resistance, 14L-TSSOP

θJA

—100

—

°C/W

Thermal Resistance, 16L-QFN

θJA

—

52.1

—

°C/W

Note 1:

Operation must not cause TJ to exceed the Maximum Junction Temperature specification (+150°C).

Measured on a standard JC51-7, four-layer printed circuit board with ground plane and vias.

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