| 数据搜索系统,热门电子元器件搜索 |
|
MCP660T-E/ML 数据表(PDF) 20 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
MCP660T-E/ML 数据表(HTML) 20 Page - Microchip Technology |
|
20 / 68 page ![]() MCP660/1/2/3/4/5/9 DS20002194E-page 20 2009-2014 Microchip Technology Inc. 3.1 Analog Outputs The analog output pins (VOUT) are low-impedance voltage sources. 3.2 Analog Inputs The non-inverting and inverting inputs (VIN+, VIN-, …) are high-impedance CMOS inputs with low bias currents. 3.3 Power Supply Pins The positive power supply (VDD) is 2.5V to 5.5V higher than the negative power supply (VSS). For normal operation, the other pins are between VSS and VDD. Typically, these parts are used in a single (positive) supply configuration. In that case, VSS is connected to Ground and VDD is connected to the supply. VDD will need bypass capacitors. 3.4 Chip Select Digital Input (CS) The input (CS) is a CMOS, Schmitt-triggered input that places the part into a low-power mode of operation. 3.5 Exposed Thermal Pad (EP) There is an internal connection between the exposed thermal pad (EP) and the VSS pin; they must be connected to the same potential on the printed circuit board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance ( JA). |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |