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MCP660T-E/ML 数据表(PDF) 65 Page - Microchip Technology |
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MCP660T-E/ML 数据表(HTML) 65 Page - Microchip Technology |
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65 / 68 page  2009-2014 Microchip Technology Inc. DS20002194E-page 65 MCP660/1/2/3/4/5/9 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . PART NO. -X /XX Package Temperature Range Device Device: MCP660 Triple Op Amp MCP660T Triple Op Amp (Tape and Reel) (SOIC, TSSOP, QFN) MCP661 Single Op Amp MCP661T Single Op Amp (Tape and Reel) (SOIC, SOT-23 and TDFN) MCP662 Dual Op Amp MCP662T Dual Op Amp (Tape and Reel) (DFN, MSOP and SOIC) MCP663 Single Op Amp with CS MCP663T Single Op Amp with CS (Tape and Reel) (SOIC and SOT-23) MCP664 Quad Op Amp MCP664T Quad Op Amp (Tape and Reel) (SOIC, TSSOP) MCP665 Dual Op Amp with CS MCP665T Dual Op Amp with CS (Tape and Reel) (DFN and MSOP) MCP669 Quad Op Amp with CS MCP669T Quad Op Amp with CS (Tape and Reel) (QFN) Temperature Range: E = -40°C to +125°C Package: CHY = Plastic Small Outline (SOT-23), 6-lead MF = Plastic Dual Flat, No Lead (3×3 DFN), 8-lead, 10-lead ML = Plastic Quad Flat, No Lead Package (4x4 QFN), (4x4x0.9 mm), 16-lead MNY= Plastic Dual Flat, No Lead (2x3 TDFN), 8-lead MS = Plastic Micro Small Outline (MSOP), 8-lead OT = Plastic Small Outline (SOT-23), 5-lead SL = Plastic Small Outline, Narrow, (3.90 mm SOIC), 14-lead SN = Plastic Small Outline (3.90 mm), 8-lead ST = Plastic Thin Shrink Small Outline, (4.4 mm TSSOP), 14-lead UN = Plastic Micro Small Outline (MSOP), 10-lead * Y = Nickel palladium gold manufacturing designator. Only available on the TDFN package. Examples: a) MCP660T-E/ML: Tape and Reel Extended temperature, 16LD QFN package b) MCP660T-E/SL: Tape and Reel Extended temperature, 14LD SOIC package c) MCP660T-E/ST: Tape and Reel Extended temperature, 14LD TSSOP package d) MCP661T-E/SN: Tape and Reel Extended temperature, 8LD SOIC package e) MCP661T-E/MNY: Tape and Reel, Extended Temperature, 8LD TDFN package f) MCP662T-E/MF: Tape and Reel Extended temperature, 8LD DFN package g) MCP662T-E/MS: Tape and Reel Extended temperature, 8LD MSOP package h) MCP662T-E/SN: Tape and Reel Extended temperature, 8LD SOIC package i) MCP663T-E/SN: Tape and Reel Extended temperature, 8LD SOIC package j) MCP663T-E/CHY: Tape and Reel, Extended Temperature, 6LD SOT-23 package k) MCP664T-E/SL: Tape and Reel Extended temperature, 14LD SOIC package l) MCP664T-E/ST: Tape and Reel Extended temperature, 14LD TSSOP package m) MCP665T-E/MF: Tape and Reel Extended temperature, 10LD DFN package n) MCP665T-E/UN: Tape and Reel Extended temperature, 10LD MSOP package o) MCP669T-E/ML: Tape and Reel Extended temperature, 16LD QFN package |
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