HMC6505ALC5TR-R5 datasheet(28/30 Pages) AD

28 / 30 page

HMC6505A

Data Sheet

Rev. 0 | Page 28 of 30

EVALUATION BOARD INFORMATION

The circuit board used in the application must use RF circuit

design techniques. Signal lines must have 50 Ω impedance and

connect the package ground leads and exposed pad directly to

the ground plane similarly to that shown in Figure 104. Use a

sufficient number of via holes to connect the top and bottom

ground planes. The evaluation board shown in Figure 106 is

available from Analog Devices upon request.

EV1HMC6505ALC5 Power-On Sequence

To set up the EV1HMC6505ALC5, take the following steps:

1. Power up VGG with a −2 V supply.

2. Power up VDD1 with a 5 V supply.

3. Power up VDD2 and VDD3 with another 5 V supply.

4. Power up VCTRL with a −4 V supply (for maximum

conversion gain).

5. Adjust the VGG supply between −2 V to 0 V until the total

RF supply current (IDD2 + IDD3) = 120 mA.

6. Connect LOIN to the LO signal generator with an LO

power of 4 dBm.

7. Apply the IF1 and IF2 signals.

EV1HMC6505ALC5 Power Off Sequence

To turn off the EV1HMC6505ALC5, take the following steps:

1. Turn off the LO and IF signals.

2. Set VGG to −2 V.

3. Set VCTRL to 0 V.

4. Set the VDD1, VDD2, and VDD3 supplies to 0 V and then

turn them off.

5. Turn off the VGG supply.

Layout

Solder the exposed pad on the underside of the HMC6505A to a

low thermal and electrical impedance ground plane. This pad is

typically soldered to an exposed opening in the solder mask on

the evaluation board. Connect these ground vias to all other

ground layers on the evaluation board to maximize heat

dissipation from the device package. Figure 104 and Figure 105

show the printed circuit board land pattern footprint for the

HMC6505A and the solder paste stencil for the HMC6505A

evaluation board.

0.138" SQUARE MASK OPENING

0.02 ×45° CHAMFER FOR PIN1

0.197"

[0.50]

PAD SIZE

0.026" × 0.010"

0.217" SQUARE

0.004" MASK/METAL OVERLAP

0.010" MIN MASK WIDTH

0.010" REF

0.030"

MASK OPENING

0.156"

MASK

OPENING

PIN 1

GROUND PAD

SOLDERMASK

0.146" SQUARE

GROUND PAD

ø.010"

TYPICAL VIA

ø.034"

TYPICAL

VIA SPACING

Figure 104. Printed Circuit Board Land Pattern Footprint

0.219

SQUARE

0.017

0.027

TYP

0.010

TYP

0.0197

TYP

R0.0040 TYP

132 PLCS

0.132

SQUARE

Figure 105. Solder Paste Stencil

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