LT8337/LT8337-1

2

Rev. 0

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PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

SYNC/MODE, FB .........................................................6V

PG (LT8337) .............................................................10V

Operating Junction Temperature Range (Notes 2, 3)

LT8337EV/LT8337EV-1...................... –40°C to 125°C

LT8337JV/LT8337JV-1 ....................... –40°C to 150°C

Storage Temperature Range .................. –65°C to 150°C

Maximum Reflow (Package Body)

Temperature......................................................260°C

(Note 1)

ORDER INFORMATION

PART NUMBER

PART MARKING

PAD FINISH

PACKAGE*

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LT8337EV#PBF

LHKR

e4

Au (RoHS)

LQFN (Laminate

Package with QFN

Footprint)

3

–40°C to 125°C

LT8337JV#PBF

–40°C to 150°C

LT8337EV-1#PBF

LHNW

–40°C to 125°C

LT8337JV-1#PBF

–40°C to 150°C

• Contact the factory for parts specified with wider operating temperature

ranges. Pad or ball finish code is per IPC/JEDEC J-STD-609.

*The LT8337/LT8337-1 package has the same dimensions as a standard

3mm × 3mm QFN.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

LT8337

LT8337-1

16 15 14 13

5

6

7

8

TOP VIEW

LQFN PACKAGE

16-LEAD (3mm × 3mm) LQFN

EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB

1

SYNC/MODE

RT

GND

FB

BST

SW

SW

SW

12

11

10

9

2

3

4

NC

NC

NC

NC

17

GND

16 15 14 13

5

6

7

8

TOP VIEW

LQFN PACKAGE

16-LEAD (3mm × 3mm) LQFN

EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB

1

SYNC/MODE

RT

GND

FB

BST

SW

SW

SW

12

11

10

9

2

3

4

NC

NC

NC

NC

17

GND