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LT8331 数据表(PDF) 20 Page - Analog Devices

部件名 LT8331
功能描述  28V, 5A Low IQ Synchronous Step-Up Silent Switcher with PassThru
PDF  24 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

LT8331 数据表(HTML) 20 Page - Analog Devices

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LT8337/LT8337-1
20
Rev. 0
For more information www.analog.com
Low IQ, Low EMI, 15V Output Boost Converter with SSFM
L1: WURTH ELEKTRONIK 74438357015
L2: WURTH ELEKTRONIK 74479290125
FB1: WURTH ELEKTRONIK 742792040
* THE EMI PERFORMANCE IS SHOWN IN THE TYPICAL PERFORMANCE CHARACTERISTICS SECTION.
VOUT
12V
1.5A
0.1µF
50V
X7R
0.1µF
50V
X7R
OUTPUT EMI FILTER
FB1
22µF
25V
X7R
×4
1µF
50V
X7R
×2
INTVCC
SYNC/MODE
PG
VIN
SW
BST
EN/UVLO
FB
GND
VOUT
LT8337
83371 TA02a
RT
L1
1.5µH
0.1µF
1M
90.9k
1µF
47.5k
2MHz
4.7pF
49.9k
1M
332k
UVLOFALLING = 4V
VIN
4.5V TO 10V
22µF
25V
X7R
47µF
35V
10µF
25V
X7R
INPUT EMI FILTER
L2
0.25µH
+
The exposed pad on the bottom of the package should
be soldered to the ground plane to reduce the package
thermal resistance. To keep the thermal resistance low,
extend the ground plane as much as possible, and add
many thermal vias to additional power ground planes
within the circuit board.
Thermal Considerations
Care should be taken in the layout of the PCB to ensure
good heat sinking of the LT8337/LT8337-1. The power
ground plane should consist of large copper layers with
thermal vias; these layers spread heat dissipated by the
IC. Placing additional vias can reduce thermal resistance
further. The maximum load current should be derated
as the junction temperature approaches its maximum
temperature rating. Power dissipation within the IC can
APPLICATIONS INFORMATION
be estimated by calculating the total power loss from an
efficiency measurement and subtracting the inductor loss.
The junction temperature can be calculated by multiply-
ing the total IC power dissipation by the thermal resis-
tance from junction to ambient and adding the ambient
temperature. The IC includes internal overtemperature
protection that is intended to protect the device during
momentary overload conditions. The overtemperature
protection shuts down the IC when the junction tem-
perature exceeds 170°C (typ). The internal soft-start is
triggered when the junction temperature drops below
165°C (typ). The maximum rated junction temperature
is exceeded when this protection is active. Continuous
operation above the specified absolute maximum operat-
ing junction temperature (see Absolute Maximum Ratings
section) may impair device reliability or permanently dam-
age the device.
TYPICAL APPLICATIONS



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