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LTYB 数据表(PDF) 8 Page - Linear Technology |
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LTYB 数据表(HTML) 8 Page - Linear Technology |
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8 / 12 page ![]() LTC1983-3/LTC1983-5 8 sn1983 1983fs Inrush Currents During normal operation, VIN will experience current tran- sients in the several hundred milliamp range whenever the charge pump is enabled. During start-up, these inrush currents may approach 1 to 2 amps. For this reason, it is important to minimize the source resistance between the input supply and the VIN pin. Too much source resistance may result in regulation problems or even prevent start- up. One way that this can be avoided (especially when the source impedance can’t be lowered due to system con- straints) is to use a large VIN capacitor with low ESR right at the VIN pin. If ceramic capacitors are used, you may need to add 1 µF to 10µF tantalum capacitor in parallel to limit input voltage transients. Input voltage transients will occur if VIN is applied via a switch or a plug. One example of this situation is in USB applications. Ultralow Quiescent Current Regulated Supply The LTC1983 contains an internal resistor divider (refer to the Block Diagram) that draws only 1 µA (typ for the 3V version) from VOUT during normal operation. During shut- down, the resistor divider is disconnected from the output and the part draws only leakage current from the output. During no-load conditions, applying a 1Hz to 100Hz, 2% to 5% duty cycle signal to the SHDN pin ensures that the circuit of Figure 2 comes out of shutdown frequently enough to maintain regulation even under low-load condi- tions. Since the part spends nearly all of its time in shutdown, the no-load quiescent current is essentially zero. However, the part will still be in operation during the time the SHDN pin is high, so the current will not be zero and can be calculated using the following equations to determine the approximate maximum current: IIN(MAX) = [(Time out of shutdown) • (Burst Mode operation quies- cent current) + (Normal operating IIN) • (Time output is being charged before the LTC1983 enters Burst Mode operation)]/(Period of SHDN signal). This number will be highly dependent on the amount of board leakage current and how many devices are connected to VOUT (each will draw some leakage current) and must be calculated and verified for each different board design. The LTC1983 must be out of shutdown for a minimum duration of 200 µstoallowenoughtimetosensetheoutput and keep it in regulation. A 1Hz, 2% duty cycle signal will keep VOUT in regulation under no-load conditions. Even though the term no-load is used, there will always be board leakage current and leakage current drawn by anything connected to VOUT. This is why it is necessary to wake the part up every once in a while to verify regulation. As the VOUT load current increases, the frequency with which the part is taken out of shutdown must also be increased to prevent VOUT from drooping below the – 2.88V (for the 3V version) during the OFF phase (see Figure 3). A 100Hz, 2% duty cycle signal on the SHDN pin ensures proper regula- tion with load currents as high as 100 µA. When load current greater than 100 µA is needed, the SHDN pin must be forced high as in normal operation. Each time the LTC1983 comes out of shutdown, the part delivers a minimum of one clock cycle worth of charge to the output. Under high VIN (>4V) and/or low IOUT (<10µA) conditions, this behavior may cause a net excess of charge to be delivered to the output capacitor if a high frequency signal is used on the SHDN pin (e.g., 50Hz to 100Hz). Under such conditions, VOUT will slowly drift positive and may even go out of regulation. To avoid this potential Figure 2. Ultralow Quiescent Current Regulated Supply VIN GND C + SHDN VOUT C – LTC1983-3 CFLY 1 µF CERAMIC FROM MPU SHDN VIN CIN 10 µF TANTALUM COUT 10 µF CERAMIC SHDN PIN WAVEFORMS: LOW IQ MODE (IOUT ≤ 100µA) VOUT LOAD ENABLE MODE (IOUT = 100µA TO 100mA) (1Hz TO 100Hz, 2% TO 5% DUTY CYCLE) –3V ± 4% 1983 F02 3.3V TO 5.5V OPERATIO (Refer to Block Diagram) |
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