Data Sheet

ADCLK914

Rev. B | Page 5 of 11

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

6.0 V

Input Voltage

Maximum Output Voltage

Minimum Output Voltage

Input Termination

±2 V

Voltage Reference

Operating Temperature Range, Ambient

−40°C to +125°C

Operating Temperature, Junction

150°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL PERFORMANCE

To determine the junction temperature on the application PCB

where:

top center of package.

PD is the power dissipation.

design considerations.

Table 3. Thermal Parameters for ADCLK914 16-Lead LFCSP

Symbol

Value

Units

Junction-to-ambient thermal

resistance, 0.0 meters per sec air

flow per JEDEC JESD51-2 (still air)

78.4

°C/W

Junction-to-ambient thermal

resistance, 1.0 meter per sec air flow

per JEDEC JESD51-6 (moving air)

68.5

°C/W

Junction-to-ambient thermal

resistance, 2.5 m/s air flow per

JEDEC JESD51-6 (moving air)

61.4

°C/W

Junction-to-board thermal

resistance, 1.0 meter per sec air flow

per JEDEC JESD51-8 (moving air)

48.8

°C/W

Junction-to-case thermal resistance

(die-to-heatsink) per MIL-Std 883,

Method 1012.1

1.5

°C/W

Junction-to-top-of-package

characterization parameter, 0

meters per sec air flow per JEDEC

JESD51-2 (still air)

2.0

°C/W

1

Descriptions based on using a 2s2p test board.

ESD CAUTION