ADCLK914

Data Sheet

Rev. B | Page 6 of 11

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

12

11

10

1

3

4

9

2

NOTES

1. NC = NO CONNECT. NO PHYSICAL CONNECTION TO THE DIE.

2. EXPOSED PAD. NO CONNECT. THE METALLIC BACK SURFACE OF THE PACKAGE

IS NOT ELECTRICALLY CONNECTED TO ANY PART OF THE CIRCUIT. IT CAN BE LEFT FLOATING

FOR OPTIMAL ELECTRICAL ISOLATION BETWEEN THE PACKAGE HANDLE AND THE SUBSTRATE

OF THE DIE. IT CANALSO BE SOLDERED TO GROUND ON THE APPLICATION BOARD IF IMPROVED

THERMAL AND/OR MECHANICAL STABILITY IS NEEDED. EXPOSED METAL AT THE CORNERS OF

THE PACKAGE IS CONNECTED TO THIS BACK SURFACE. ALLOW SUFFICIENT CLEARANCE FOR

VIAS AND OTHER COMPONENTS.

D

D

NC

NC

Q

Q

NC

NC

ADCLK914

TOP VIEW

(Not to Scale)

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

D

Noninverting Input.

2

D

Inverting Input.

3, 4, 5, 6, 9, 10

NC

No Connect. No physical connection to the die.

7, 14

Negative Supply Voltage.

8, 13

Positive Supply Voltage.

11

Q

Inverting Output.

12

Q

Noninverting Output.

15

Reference Voltage. Reference voltage for biasing ac-coupled inputs.

16

Center Tap. Center tap of 100 Ω input resistor.

Heat Sink/

Exposed Pad

NC

No Connect. The metallic back surface of the package is not electrically connected to any part of the circuit.

It can be left floating for optimal electrical isolation between the package handle and the substrate of the

die. It can also be soldered to ground on the application board if improved thermal and/or mechanical

stability is needed. Exposed metal at the corners of the package is connected to this back surface. Allow

sufficient clearance for vias and other components.