ADUCM3027BCBZ-R7 datasheet(29/39 Pages) AD

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Data Sheet

ADuCM3027/ADuCM3029

Rev. B | Page 29 of 39

DEVELOPMENT SUPPORT

Development support for the ADuCM3027/ADuCM3029 MCU

includes documentation, evaluation hardware, and

development software tools.

Documentation

The ADuCM302x Ultra Low Power ARM Cortex-M3 MCU

with Integrated Power Management Hardware Reference details

the functionality of each block on the ADuCM3027/ADuCM3029

MCUs. It includes power management, clocking, memories, and

peripherals.

Hardware

The EV-COG-AD3029LZ is available to prototype sensor

configurations with the ADuCM3027/ADuCM3029 MCUs.

Software

The EV-COG-AD3029LZ includes a complete development and

debug environment for the ADuCM3027/ADuCM3029 MCUs.

The device family pack (DFP) for the ADuCM3027/

ADuCM3029 is provided for the IAR Embedded Workbench

for ARM, Keil™, and CrossCore® embedded studio (CCES)

environments.

The DFP also includes operating system (OS) aware drivers and

example code for all the peripherals on the devices.

ADDITIONAL INFORMATION

The following documentation that describe the ADuCM3027/

ADuCM3029 MCUs can be ordered from any Analog Devices

sales office or accessed electronically on the Analog Devices

website:



ADuCM302x Ultra Low Power ARM Cortex-M3 MCU

with Integrated Power Management Hardware Reference.

This data sheet describes the ARM Cortex-M3 core and

memory architecture used on the ADuCM3027/ADuCM3029

MCUs but does not provide detailed programming information

for the ARM processor. For more information about

programming the ARM processor, visit the ARM Infocenter

web page.

The applicable documentation for programming the ARM

Cortex-M3 processor include the following:



ARM Cortex-M3 Devices Generic User Guide



ARM Cortex-M3 Technical Reference Manual

REFERENCE DESIGNS

The Circuits from the Lab® page provides the following for the

ADuCM3027/ADuCM3029 reference design:



Graphical circuit block diagram presentation of signal

chains for a variety of circuit types and applications



Drill down links for components in each chain to selection

guides and application information



Reference designs applying best practice design techniques

MCU TEST CONDITIONS

The ac signal specifications (timing parameters) appearing in

this data sheet include output disable time, output enable time,

and others. Timing is measured on signals when they cross the

voltage threshold (VMEAS) level as described in Figure 24. All

delays (in nanoseconds or microseconds) are measured between

the point that the first signal reaches VMEAS and the point that

the second signal reaches VMEAS. The value of VMEAS is set to

VBAT/2. The tester pin electronics is shown in Figure 25.

INPUT

OUTPUT

VMEAS

Figure 24. Voltage Reference Levels for AC Measurements (Except Output

Enable/Disable)

VLOAD

50Ω

70Ω

45Ω

ZO = 50Ω (IMPEDANCE)

TD = 4.04ns ± 1.18ns

50Ω

400Ω

2pF

0.5pF

4pF

DUT

OUTPUT

NOTES

1. THE WORST-CASE TRANSMISSION LINE DELAY (TD) IS SHOWN AND

CAN BE USED FOR THE OUTPUT TIMING ANALYSIS TO REFLECT THE

TRANSMISSION LINE EFFECT AND MUST BE CONSIDERED.

TRANSMISSION LINE IS FOR LOAD ONLY AND DOES NOT AFFECT

THE DATA SHEET TIMING SPECIFICATIONS.

2. ANALOG DEVICES RECOMMENDS USING THE IBIS MODEL TIMING

FOR A GIVEN SYSTEM REQUIREMENT. IF NECESSARY, A SYSTEM

CAN INCORPORATE EXTERNAL DRIVERS TO COMPENSATE FOR

ANY TIMING DIFFERENCES.

Figure 25. Equivalent Device Loading for AC Measurements

(Includes All Fixtures)

DRIVER TYPES

Table 24 shows the driver types.

Table 24. Driver Types

Driver Type1, 2, 3

Associated Pins

Type A

P0_00 to P0_03, P0_07, P0_10 to P0_13,

P0_15, P1_00 to P1_10, P1_15, P2_00, P2_01,

P2_04 to P2_14, P3_00 to P3_03, and

SYS_HWRST.

Type B

P0_08, P0_09, P0_14, P1_11 to P1_14, and

P2_02

Type C

P0_04 and P0_05

Type D

P0_06

1 In single drive mode, the maximum source/sink capacity is 2 mA.

2 In double drive mode, the maximum source/sink capacity is 4 mA.

3 At maximum drive capacity, only 16 GPIOs are allowed to switch at any

given point of time.

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