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2CL79 数据表(PDF) 5 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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2CL79 数据表(HTML) 5 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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5 / 8 page ![]() Discontinuity Electrify Test: The rectifier shall be threw forward pulse current of IF= 30mA,VR=0,turn on 3 min, turn off 3 min,went on 500 hours, the rectifier shall satisfy item 7.2 to 7.3 . 8. 使用须知 Handling instructions 这种二极管在空气中不能保证其额定电压和反向特性,故应使用以环氧为主体的树脂进行再次封装, 改变外形尺寸以增大爬电距离。 These diodes have been developed to attain size reduction assuming remolding with epoxy-base resin to endure the creeping distance. It is therefore, impossible to guarantee the rated voltage and backward characteristics in the air. 8.1 验收检查的特殊注意点 Special notes for acceptance inspection a .再次封装下的特性检查:考虑到爬电距离和热辐射,应将二极管用环氧封装成φ8mm×40mm 的圆柱 体,然后进行特性检查或可靠性试验。 Characteristics inspection in remolded state: Molt the diode with epoxy to form a cylinder with the size of 8 mm DIA X 40mm L considering the creeping distance and heat radiation. Inspect the characteristics or reliability after remolding. b. 在绝缘油中的特性检查: 非再次封装下的特性检查一般在绝缘油(硅油)或六氟化物中进行。然而六 氟化物是挥发性的,硅油是不挥发的。测试后的清洗要特别小心,因为通常使用的是有机溶剂,如:三 氯乙烯或二甲苯。 Characteristics inspection in insulating oil: Characteristics inspection without remolding is generally carried out in insulating oil (silicone oil or fluoride).While fluoride volatile, silicone oil is not. Washing after the test needs special care. Generally an organic solvent such as trichloroethylene or xylene is used. 8.2 装配注意点 Special note for assembly a. 高压硅二极管表面必须保持清洁,高压硅二极管与再次封装树脂之间的界面必须保证足够的附着力。 The surface of a high voltage silicon diode must be kept clean. The interface between a high voltage silicon diode and the remolding resin must ensure sufficient adhesion. b. 再次封装的树脂内不允许有气泡,因为气泡会降低绝缘性和可靠性,特别是在高压硅二极管的附近更 另不允许有气泡。 No air bubble is allowed in the remolding, resin because it degrades the insulation and reliability. It must not exist especially near the high voltage silicon diode. c.再次封装时使用环氧树脂会使膨胀或收缩的应力最小,从而避免对二极管产生影响。如果采用环氧系 以外的树脂,应仔细查其附着力和密封性,以避免水气进入。 The resin material for remolding should be epoxy-base resin and minimum stress from expansion or contraction shall be generated as so to prevent bad influence on the diode .If any resin other than epoxy-base one is used, the adhesion and airtightness to prevent moisture entrance shall be well examined. 2CL79 Rev 2.0 : www.leiditech.com 12.01.2019 5/8 |
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