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MP7641AS 数据表(PDF) 7 Page - Exar Corporation

部件名 MP7641AS
功能描述  8-Channel Voltage Output 10 MHz Input Bandwidth 8-Bit Multiplying DACs with Serial Digital Port
PDF  24 Pages
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制造商  EXAR [Exar Corporation]
网页  http://www.exar.com
标志 EXAR - Exar Corporation

MP7641AS 数据表(HTML) 7 Page - Exar Corporation

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MP7641
7
Rev. 2.00
ELECTRICAL CHARACTERISTICS TABLE
Description
Symbol
Min
Typ
Max
Min
Max
Units
Conditions
DIGITAL TIMING
SPECIFICATIONS2, 4
Input Clock Pulse Width
tCH, tCL
40
50
ns
Data Setup Time
tDS
10
10
ns
Data Hold Time
tDH
15
15
ns
CLK to SDO Propagation Delay
tPD
40
50
ns
DAC Register Load Pulse Width
tLD
100
100
ns
Reset Pulse Width
tRST
50
60
ns
Clock Edge to Load Rising Edge
tCKLD1
100
100
ns
Clock Edge to Load Falling Edge
tCKLD2
00
ns
Load Falling Edge to SDO
tHZ1
50
60
ns
3-state Enable
Load Rising Edge to SDO
tHZ2
35
50
ns
3-state Disable
Load Falling Edge to CLK Disable
tLDCK1
25
40
ns
Load Rising Edge to CLK Enable
tLDCK2
35
50
ns
LD Set-up Time with Respect
tLDSU
15
20
ns
to CLK
NOTES
1
Full Scale Range (FSR) is 3V.
2
Guaranteed but not production tested.
3
Digital input levels should not go below ground or exceed the positive supply voltage, otherwise damage may occur.
4
See Figures 2 and 3.
5
For reference input pulse: tR = tF > 100 ns.
25
°C
Tmin to Tmax
Specifications are subject to change without notice
ABSOLUTE MAXIMUM RATINGS (TA = +25
°C unless otherwise noted)1,2
VCC to AGND
+6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VEE to AGND
–6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCC to DGND
+13.0 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VEE to DGND
–6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VRi to AGND
VCC to VEE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VOi to AGND
VCC to VEE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Input & Output Voltage to DGND –0.5 to VDD +0.5 V
Operating Temperature Range
Extended Industrial
–40
°C to +85°C
. . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature
–65
°C to 150°C
. . . . . . . . .
Storage Temperature
150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (Soldering, 10 sec)
+300
°C
. . . . . . . . . . .
Package Power Dissipation Rating @ 75
°C
PDIP, SOIC
1000mW
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Derates above 75
°C
6mW/
°C
. . . . . . . . . . . . . . . . . . . . . .
NOTES:
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2
Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies.
All inputs have protection diodes which will protect the device from short
transients outside the supplies of less than 100mA for less than 100
µs.
APPLICATIONS INFORMATION
Refer to Section 8 for Applications Information



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