MPC8347ECVRADDB datasheet(88/99 Pages) NXP

88 / 99 page

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12

Freescale Semiconductor

Thermal

Table 67 and Table 68 show heat sink thermal resistance for TBGA and PBGA of the MPC8347EA.

Table 67. Heat Sink and Thermal Resistance of MPC8347EA (TBGA)

Heat Sink Assuming Thermal Grease

Air Flow

× 35 mm TBGA

Thermal Resistance

AAVID 30

× 30 × 9.4 mm pin fin

Natural convection

AAVID 30

× 30 × 9.4 mm pin fin

1 m/s

6.5

AAVID 30

× 30 × 9.4 mm pin fin

2 m/s

5.6

AAVID 31

× 35 × 23 mm pin fin

Natural convection

8.4

AAVID 31

× 35 × 23 mm pin fin

1 m/s

4.7

AAVID 31

× 35 × 23 mm pin fin

2 m/s

Wakefield, 53

× 53 × 25 mm pin fin

Natural convection

5.7

Wakefield, 53

× 53 × 25 mm pin fin

1 m/s

3.5

Wakefield, 53

× 53 × 25 mm pin fin

2 m/s

2.7

MEI, 75

× 85 × 12 no adjacent board, extrusion

Natural convection

6.7

MEI, 75

× 85 × 12 no adjacent board, extrusion

1 m/s

4.1

MEI, 75

× 85 × 12 no adjacent board, extrusion

2 m/s

2.8

MEI, 75

× 85 × 12 mm, adjacent board, 40 mm side bypass

1 m/s

3.1

Table 68. Heat Sink and Thermal Resistance of MPC8347EA (PBGA)

Heat Sink Assuming Thermal Grease

Air Flow

× 29 mm PBGA

Thermal Resistance

AAVID 30

× 30 × 9.4 mm pin fin

Natural convection

13.5

AAVID 30

× 30 × 9.4 mm pin fin

1 m/s

9.6

AAVID 30

× 30 × 9.4 mm pin fin

2 m/s

8.8

AAVID 31

× 35 × 23 mm pin fin

Natural convection

11.3

AAVID 31

× 35 × 23 mm pin fin

1 m/s

8.1

AAVID 31

× 35 × 23 mm pin fin

2 m/s

7.5

Wakefield, 53

× 53 × 25 mm pin fin

Natural convection

9.1

Wakefield, 53

× 53 × 25 mm pin fin

1 m/s

7.1

Wakefield, 53

× 53 × 25 mm pin fin

2 m/s

6.5

MEI, 75

× 85 × 12 no adjacent board, extrusion

Natural convection

10.1

MEI, 75

× 85 × 12 no adjacent board, extrusion

1 m/s

7.7

MEI, 75

× 85 × 12 no adjacent board, extrusion

2 m/s

6.6

MEI, 75

× 85 × 12 mm, adjacent board, 40 mm side bypass

1 m/s

6.9

MPC8347ECVRADDB 数据表(PDF) 88 Page - NXP Semiconductors

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