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ADP1607ACPZN-R7 数据表(PDF) 14 Page - Analog Devices

部件名 ADP1607ACPZN-R7
功能描述  2 MHz, Synchronous Boost DC-to-DC Converters
PDF  16 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP1607ACPZN-R7 数据表(HTML) 14 Page - Analog Devices

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ADP1606/ADP1607
Data Sheet
LAYOUT GUIDELINES
1
2
3
4
5
6
EN
GND
SW
VOUT
MODE
VIN
COUT
0402
CIN
0402
2.25mm
ADP1606
TOP VIEW
7
EPAD
L
2.2µH
0805
Figure 30. ADP1606 Recommended Layout Showing the Smallest Footprint
1
2
3
4
5
6
EN
GND
SW
VOUT
FB
VIN
R1
0402
R2
0402
COUT
0402
CIN
0402
3.0mm
ADP1607
TOP VIEW
7
EPAD
L
2.2µH
0805
Figure 31. ADP1607 Recommended Layout Showing the Smallest Footprint
For high efficiency, good regulation, and stability, a well
designed PCB layout is required.
Use the following guidelines when designing a PCB. See
Figure 28 for a block diagram, and Figure 3 and Figure 4 for pin
configurations.
Keep the low ESR input capacitor, CIN, close to VIN and
GND. This minimizes noise injected into the device from
board parasitic inductance.
Keep the high current path from CIN through the L
inductor to SW as short as possible.
For ADP1607, place the feedback resistors, R1 and R2, as
close to FB as possible to prevent noise pickup. Connect
the ground of the feedback network directly to an AGND
plane that makes a Kelvin connection to the GND pin. See
Figure 31 for more information.
Avoid routing high impedance traces from feedback
resistors near any node connected to SW or near the
inductor to prevent radiated noise injection.
Keep the low ESR output capacitor, COUT, close to VOUT
and GND. This minimizes noise injected into the device
from board parasitic inductance.
Connect Pin 7 (EPAD) and GND to a large copper plane
for proper heat dissipation.
Rev. D | Page 14 of 16



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