Data Sheet

ADP5076

Rev. A | Page 23 of 23

OUTLINE DIMENSIONS

A

B

C

D

E

2.220

2.180

2.140

1.650

1.610

1.570

1

2

3

4

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

BOTTOM VIEW

(BALL SIDE UP)

BALL A1

IDENTIFIER

0.40

BSC

0.560

0.500

0.440

0.330

0.300

0.270

0.230

0.200

0.170

0.225

0.205

0.185

0.310

0.290

0.270

0.300

0.260

0.220

1.60 REF

1.20 REF

COPLANARITY

0.04

SEATING

PLANE

Figure 49. 20-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-20-14)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADP5076ACBZ-R7

−40°C to +125°C

20-Ball Wafer Level Chip Scale Package [WLCSP]

CB-20-14

ADP5076CB-EVALZ

Evaluation Board

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registered trademarks are the property of their respective owners.

D20402-0-12/19(A)