STP08CDC596

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Table 5: Thermal Data

Table 6: Recommended Operating Conditions

(1) If the device is connected in cascade, it may not be possible achieve the maximum data transfer. Please considered the timings carefully.

(2) In normal mode the OE/DM2 must remain low at least two clock cycles.

Symbol

Parameter

DIP-16

SO-16

TSSOP16

Unit

Thermal Resistance Junction-ambient

90

125

140

°C/W

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Supply Voltage

3.3

5.5

V

Output Voltage

16.0

V

Output Current

OUTn

15

120

mA

Output Current

SERIAL-OUT

+1

mA

Output Current

SERIAL-OUT

-1

mA

Input Voltage

V

Input Voltage

-0.3

V

LE/DM1 Pulse Width

10

20

ns

CLK Pulse Width

10

20

ns

OE/DM2 Pulse Width (1)

120

400

ns

5

20

ns

Hold Time for DATA

4

15

ns

8

15

ns

Clock Frequency (2)

25

MHz

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Input Voltage High Level

V

Input Voltage Low Level

GND

V

Output Leakage Current

10

µA

0.4

V

V

Output Current

18.8

20.9

24.00

mA

46.00

51.5

56.5

mA

Output Current Error

between bit (All Output ON)

± 2

± 5

%

± 1

± 4

%

Pull-up Resistor

150

300

600

K

Ω

100

200

400

K

Ω

OUT 0 to 7 = OFF

0.45

0.7

mA

OUT 0 to 7 = OFF

3.0

6.0

OUT 0 to 7 = OFF

8.2

12.0

Supply Current (ON)

OUT 0 to 7 = ON

3.1

6.2

OUT 0 to 7 = ON

8.4

12.8