Data Sheet

ADRF5345

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 4 of 11

Table 2.

Parameter

Rating

–0.3 V to +5.5 V

–0.3 V to +3.6 V

Average

42.5 dBm

Peak

52.5 dBm

Temperature

Junction

135°C

Storage

–65°C to +150°C

Reflow

260°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

thermal resistance.

Table 3. Thermal Resistance

Package Type

Unit

CC-22-2

37

°C/W

transfer is due solely to the thermal conduction from the channel through the

ground pad to the PCB, and the ground pad is held constant at the operating

temperature of 105°C.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for the ADRF5345

Table 4. ADRF5345, 22-Terminal LGA

ESD Model

Withstand Threshold (V)

Class

HBM

2000

2

CDM

1000

C3

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.