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ADCMP580 数据表(PDF) 9 Page - Analog Devices |
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ADCMP580 数据表(HTML) 9 Page - Analog Devices |
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9 / 16 page ![]() Preliminary Technical Data ADCMP580/ADCMP581/ADCMP582 Rev. PrA | Page 9 of 16 APPLICATION INFORMATION POWER/GROUND LAYOUT AND BYPASSING The ADCMP58x family of comparators is designed for very high speed applications. Consequently, high speed design techniques must be used to achieve the specified performance. It is critically important to use low impedance supply planes, particularly for the negative supply (VEE), the output supply plane (VCCO) and the ground plane (GND). Individual supply planes are recommended as part of a multilayer board. Providing the lowest inductance return path for the switching currents ensures the best possible performance in the target application. It is also important to adequately bypass the input and output supplies. A 1 µF electrolytic bypass capacitor should be placed within several inches of each power supply pin to ground. In addition, multiple high quality 0.1µF bypass capacitors should be placed as close as possible to each of the VEE, VCCI, and VCCO supply pins and should be connected to the GND plane with redundant vias. High frequency bypass capacitors should be carefully selected for minimum inductance and ESR. Parasitic layout inductance should be strictly avoided to maximize the effectiveness of the bypass at high frequencies. ADCMP58x FAMILY OF OUTPUT STAGES Specified propagation delay dispersion performance can be achieved by using proper transmission line terminations. The outputs of the ADCMP580 comparators are designed to directly drive 400 mV into 50 Ω cable or microstrip/stripline transmission lines terminated with 50 Ω referenced to the GND return. The CML output stage is shown in the simplified schematic diagram in Figure 14. The outputs are each back- terminated with 50 Ω for best transmission line matching. The outputs of the ADCMP581/ADCMP582 are illustrated in Figure 15 and should be terminated to −2 V for ECL outputs of ADCMP581 and VCCO − 2 V for PECL outputs of ADCMP582. As an alternative, Thevenin equivalent termination networks may also be used. If high speed CML signals must be routed more than a centimeter, then either microstrip or stripline techniques is required to ensure proper transition times and to prevent excessive output ringing and pulse-width-dependant propagation delay dispersion. Q 16mA 50 Ω Q GND VEE Figure 14. Simplified Schematic Diagram of ADCMP580 CML Output Stage GND VEE Q Q Figure 15. Simplified Schematic Diagram of the ADCMP581/ADCMP582 ECL Output Stage USING/DISABLING THE LATCH FEATURE The latch inputs (LE/LE) are active low for latch mode, and are internally terminated with 50 Ω resistors to the VTT pin. When using the ADCMP580, VTT should be connected to ground. When using the ADCMP581, VTT should be connected to −2 V. When using the ADCMP582, VTT should be connected externally to VCCO − 2 V, preferably to its own low inductance plane. When using the ADCMP580/ADCMP582, the latch function can be disabled by connecting the LE pin to VEE with an external pull-down resistor and leaving the LE pin unconnected. To prevent excessive power dissipation, the resistor should be 1.5 kΩ. When using the ADCMP581 comparators, the latch can be disabled by connecting the LE pin to GND with an external 450 Ω resistor, and leaving the LE pin disconnected. |
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