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SN74HCS151 数据表(PDF) 4 Page - Texas Instruments |
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SN74HCS151 数据表(HTML) 4 Page - Texas Instruments |
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4 / 39 page ![]() 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage –0.5 7 V IIK Input clamp current(2) VI < –0.5 V or VI > VCC + 0.5 V ±20 mA IOK Output clamp current(2) VI < –0.5 V or VI > VCC + 0.5 V ±20 mA IO Continuous output current VO = 0 to VCC ±35 mA Continuous current through VCC or GND ±70 mA TJ Junction temperature(3) 150 °C Tstg Storage temperature –65 150 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime. (2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) Guaranteed by design. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) HBM ESD Classification Level 2 ±4000 V Charged device model (CDM), per AEC Q100-011 CDM ESD Classification Level C6 ±1500 (1) AEC Q100-002 indicate that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Supply voltage 2 5 6 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V TA Ambient temperature –40 125 °C 6.4 Thermal Information THERMAL METRIC(1) SN74HCS151-Q1 UNIT PW (TSSOP) D (SOIC) WBQB (WQFN) 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 141.2 122.2 97.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 78.8 80.9 93.8 °C/W RθJB Junction-to-board thermal resistance 85.8 80.6 66.4 °C/W ΨJT Junction-to-top characterization parameter 27.7 40.4 14.6 °C/W ΨJB Junction-to-board characterization parameter 85.5 80.3 66.4 °C/W SN74HCS151-Q1 SCLS819B – AUGUST 2020 – REVISED DECEMBER 2021 www.ti.com 4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HCS151-Q1 |
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