Package Option Addendum

Packaging Information

Orderable Device

Status (1)

Package

Type

Package

Drawing

Pins

Package

Qty

Eco Plan (2)

Lead/Ball

Finish (6)

MSL Peak Temp(3)

Op Temp

(°C)

Device

Marking (4) (5)

SN74HCS151QDRQ1

ACTIVE

SOIC

D

16

2500

RoHS & Green

NIPDAU

Level-1-260C-UNLIM

-40 to 125

HCS151Q

SN74HCS151QPWRQ1

ACTIVE

TSSOP

PW

16

2000

RoHS & Green

NIPDAU

Level-1-260C-UNLIM

-40 to 125

HCS151Q

SN74HCS151QWBQBRQ1

ACTIVE

WQFN

BQB

16

3000

RoHS & Green

NIPDAU

Level-1-260C-UNLIM

-40 to 125

CS594Q

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest

availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the

requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified

lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used

between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by

weight in homogeneous material).

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the

finish value exceeds the maximum column width.

Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on

information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.

TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming

materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Other Qualified Versions of SN74HCS151-Q1 :

• Catalog: SN74HCS151

Note: Qualified Version Definitions:

• Catalog - Ti's standard catalog product

www.ti.com

SN74HCS151-Q1

SCLS819B – AUGUST 2020 – REVISED DECEMBER 2021

Copyright © 2021 Texas Instruments Incorporated

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Product Folder Links: SN74HCS151-Q1