MCIMX503CVM8B datasheet(1/136 Pages) NXP

部件名	MCIMX503CVM8B

功能描述	i.MX50 Applications Processors for Consumer Products

PDF	136 Pages

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制造商	NXP [NXP Semiconductors]

网页	http://www.nxp.com

标志

1 / 136 page

Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX50CEC

Rev. 7, 10/2013

MCIMX50

Package Information

Plastic Package

Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch

Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch

Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 7 for ordering information.

Freescale reserves the right to change the detail specifications as may be required

to permit improvements in the design of its products.

1

Introduction

The i.MX50 applications processors are

multimedia-focused products offering high-performance

processing optimized for lowest power consumption.

The i.MX50 processors are Freescale Energy Efficiency

Solutions products.

The i.MX50 is optimized for portable multimedia

applications and features Freescale’s advanced

implementation of the ARM Cortex-A8® core, which

operates at speeds as high as 1 GHz. The i.MX50

provides a powerful display architecture, including a 2D

Graphics Processing Unit (GPU) and Pixel Processing

Pipeline (ePXP). Additionally, the i.MX50 includes a

complete integration of the electrophoretic display

function. The i.MX50 supports DDR2, LPDDR2, and

LPDDR1 DRAM at clock rate up to 266 MHz to enable

a range of performance and power trade-offs.

The flexibility of the i.MX50 architecture allows it to be

used in a variety of applications. As the heart of the

i.MX50 Applications

Processors for

Consumer Products

1.

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1.

Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2.

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.3.

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7

1.4.

Part Number Feature Comparison . . . . . . . . . . . . . 8

1.5.

Package Feature Comparison . . . . . . . . . . . . . . . . 9

2.

Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.1.

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.

Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1.

Special Signal Considerations . . . . . . . . . . . . . . . 17

4.

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20

4.1.

Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21

4.2.

Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

4.3.

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 31

4.4.

Output Buffer Impedance Characteristics . . . . . . 37

4.5.

I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 41

4.6.

System Modules Timing . . . . . . . . . . . . . . . . . . . . 48

4.7.

External Interface Module (EIM) . . . . . . . . . . . . . . 60

4.8.

DRAM Timing Parameters . . . . . . . . . . . . . . . . . . 68

4.9.

External Peripheral Interfaces . . . . . . . . . . . . . . . 73

5.

Package Information and Contact Assignments . . . . . 101

5.1.

13 x 13 mm, 0.5 mm Pitch, 416 Pin MAPBGA Package

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

5.2.

13 x 13 mm, 0.5 mm Pitch, 416 Pin PoPBGA Package

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

5.3.

17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

5.4.

Signal Assignments . . . . . . . . . . . . . . . . . . . . . . 124

6.

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

类似零件编号 - MCIMX503CVM8B

制造商	部件名	数据表	功能描述
Freescale Semiconductor...	MCIMX503CVM8B	2Mb / 134P	i.MX50 Applications Processors for Consumer Products

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