MEMSIC MXC6232xG/H/M/N Rev.A

Page 1 of 8

4/11/2010

Low Power, Low Profile

±2 g Dual Axis Accelerometer with

MXC6232xG/H/M/N

FEATURES

RoHS compliant

1.8V compatible IO

Embedded Power up/down and self-test function

On-chip temperature sensor available

Eight customer defined 7-bit addresses

2.7 V to 3.6 V single supply continuous operation

Monolithic CMOS IC

Low power consumption: typically <2 mA @ 3.0 V

Resolution better than 1 mg

On chip mixed signal processing

>50,000 g shock survival rating

Low profile LCC package: 5mm X 5mm X 1.55mm

APPLICATIONS

Information Appliances – Cell Phones, PDA’s, Computer

Peripherals

Consumer – LCD Projectors, Pedometers, Blood Pressure

Monitor, Digital Cameras

Gaming – Joystick/RF Interface/Menu Selection/Tilt

Sensing

GPS

Reckoning Assist

GENERAL DESCRIPTION

The MXC6232xG/H/M/N is low cost, dual axis

accelerometers fabricated on a standard, submicron CMOS

process. It is a complete sensing system with on-chip

the device to be connected directly to a microprocessor

eliminating the need for A/D converters or timing

resources. The MXC6232xG/H/M/N measures acceleration

with a full-scale range of

±2 g and a sensitivity of

It can measure both dynamic acceleration (e.g. vibration)

and static acceleration (e.g. gravity). The

MXC6232xG/H/M/N design is based on heat convection

and requires no solid proof mass.

VDD

VREF

CLK

TP

PD

CLK

CLKTEMP

CLK

CLK

TEMP

A/D

CLK

CLK TEMP CLK

Temp

Comp.

Temp

Comp.

X aixs

Y aixs

CLK

Heater

Control

TEMP

No

Connect

No

Connect

SCL

SDA

IIC Convertor

A/D

Temperature

Sensor

Internal

Oscillator

Coarse

Gain Adj.

Fine Gain

Adj.

GND

Acceleration

Sensor

Coarse

Gain Adj.

Fine Gain

Adj.

MXC6232xG/H/M/N FUNCTIONAL BLOCK DIAGRAM

This design eliminates the stiction problems associated with

legacy technologies and provides shock survival greater

than 50,000g’s. Memsic’s solid state design leads to

significantly lower failure rates in customer applications

and lower loss due to handling during manufacturing and

assembly processes

The MXC6232xG/H/M/N is packaged in a hermetically

sealed, low profile LCC surface mount package (5 mm x 5

mm x 1.55 mm) and is available in operating temperature

ranges of 0

°C to +70°C (G/H) and-40°C to +85°C(M/N).

400 KHz, fast mode operation.

The maximum noise floor is 1 mg/ Hz allowing signals

below 1mg to be resolved at 1 Hz bandwidth

Information furnished by MEMSIC is believed to be accurate and reliable. However,

no responsibility is assumed by MEMSIC for its use, or for any infringements of

patents or other rights of third parties which may result from its use. No license is

granted by implication or otherwise under any patent or patent rights of MEMSIC.

©MEMSIC, Inc.

One Technology Drive Suite 325,Andover MA01810,USA

Tel: 978.738.0900

Fax: 978.738.0196

www.memsic.com