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SY75603A 数据表(PDF) 5 Page - Microchip Technology

部件名 SY75603A
功能描述  2/4 Outputs Ultra-Low Additive Jitter PCIe 1/2/3/4/5 Clock Buffer
PDF  26 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

SY75603A 数据表(HTML) 5 Page - Microchip Technology

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2021 Microchip Technology Inc. and its subsidiaries
DS20006508B-page 5
SY75602A/02B/603A/03B/604A/04B
Clock Source DC Impedance (OUTx_n) for
part with 85Ω embedded differential series
resistance (parts with suffix “A”)
ZC-DC_OUT_n
34
51
Ω
Note 1, Note 9
Clock Source DC Impedance (OUTx_p) for
part with 100Ω embedded differential series
resistance (parts with suffix “B”)
ZC-DC_OUT_p
40
60
Ω
Note 1, Note 9
Clock Source DC Impedance (OUTx_n) for
part with 100Ω embedded differential series
resistance (parts with suffix “B”)
ZC-DC_OUT_n
40
60
Ω
Note 1, Note 9
Output Frequency
FMAX
0
250
MHz —
Output to Output Skew
tOOSK
30
ps
Device to Device Output Skew
tPOOSK
50
ps
Input to Output Delay
tIOD
0.9
1.2
1.5
ns
Output Enable Time
tEN
3.5
cycles Note 12
Output Disable Time
tDIS
4.5
cycles Note 12
Note 1: Measurement taken from single ended waveform.
2: Measurement taken from differential waveform.
3: Measured from –150 mV to +150 mV on the differential waveform (derived from OUTx_p to OUTx_n). The
signal must be monotonic through the measurement region for rise and fall time. The 300 mV
measurement window is centered on the differential zero crossing. See Figure 1-5.
4: Measured at crossing point where the instantaneous voltage value of the rising edge of OUTx_p equals
the falling edge of OUTx_n. See Figure 1-1.
5: Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is
crossing. Refers to all crossing points for this measurement. See Figure 1-1.
6: Defined as the maximum instantaneous voltage including overshoot. See Figure 1-1.
7: Defined as the minimum instantaneous voltage including undershoot. See Figure 1-1.
8: Defined as the total variation of all crossing voltages of Rising OUTx_p and Falling OUTx_n. This is the
maximum allowed variance in VCROSS for any particular system. See Figure 1-2.
9: System board compliance measurements must use the test load card described in Figure 1-7. OUTx_p
and OUTx_n are to be measured at the load capacitors CLOAD. Single-ended probes must be used for
measurements requiring single-ended measurements. Either single-ended probes with math or differential
probe can be used for differential measurements.
10: tSTABLE is the time the differential clock must maintain a minimum ±150 mV differential voltage after
rising/falling edges before it is allowed to droop back into the VRB ±100 mV differential range.
See Figure 1-6.
11: Matching applies to rising edge rate for OUTx_p and falling edge rate for OUTx_n. It is measured using a
±75 mV window centered on the median cross point where OUTx_p rising meets OUTx_n falling. The
median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate
calculations. The Rise Edge Rate of OUTx_p should be compared to the Fall Edge Rate of OUTx_n; the
maximum allowed difference should not exceed 20% of the slowest edge rate. See Figure 1-3.
12: Output Enable control pins are synchronous with the input clock and it takes four rising edges before out-
puts get enabled and five rising edges before outputs get disabled. Hence the minimum input frequency is
greater than 0 Hz. Once the outputs are enabled the input clock frequency can be reduced to 0 Hz.
OUTPUT ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 3.3V ±10%, 2.5V±10%; 1.8V±10%; TA = –40°C to +105°C, CLOAD = 2 pF unless
noted.
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions



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