Data Sheet

ADP1764

Rev. A | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VIN to GND

−0.3 V to +2.16 V

EN to GND

−0.3 V to +3.96 V

VOUT to GND

SENSE to GND

VREG to GND

REFCAP to GND

VADJ to GND

SS to GND

PG to GND

−0.3 V to +3.96 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Operating Junction Temperature

125°C

Lead Temperature (Soldering, 10 sec)

300°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP1764 can be damaged when the junction

temperature limits are exceeded. The use of appropriate thermal

management techniques is recommended to ensure that the

maximum junction temperature does not exceed the limits shown

in Table 4.

Use the following equation to calculate the junction temperature

parameter with units of °C/W.

4-layer board. JESD51-12, Guidelines for Reporting and Using

Electronic Package Thermal Information, states that thermal

characterization parameters are not the same as thermal

through multiple thermal paths rather than a single path as in

convection from the top of the package as well as radiation from

applications.

THERMAL RESISTANCE/PARAMETER

Values shown in Table 5 are calculated in compliance with

convection junction to ambient thermal resistance measured in a

the junction to top thermal characterization parameter.

In applications where high maximum power dissipation exists,

close attention to thermal board design is required. Thermal

resistance/parameter values may vary, depending on the PCB

material, layout, and environmental conditions.

Table 5. Thermal Resistance/Parameter

Package

Type

Unit

40.65

7.47

17.38

12.9

0.85

°C/W

1

Thermal impedance simulated values are based on a JEDEC 2S2P thermal

with four thermal vias. See JEDEC JESD51-12.

ESD CAUTION