Data Sheet

ADP165/ADP166

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +6.5 V

VOUT to GND

−0.3 V to VIN

EN to GND

−0.3 V to VIN

ADJ to GND

−0.3 V to VIN

NC to GND

−0.3 V to VIN

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Operating Ambient Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL DATA

Absolute maximum ratings only apply individually; they do not

apply in combination. The ADP165/ADP166 can be damaged

when the junction temperature limits are exceeded. Monitoring

ambient temperature does not guarantee that the junction

applications with high power dissipation and poor thermal

resistance, the maximum ambient temperature may have to be

derated.

In applications with moderate power dissipation and low printed

circuit board (PCB) thermal resistance, the maximum ambient

temperature can exceed the maximum limit as long as the junction

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on the

application and board layout. In applications where high maximum

power dissipation exists, close attention to thermal board design

layout, and environmental conditions. The specified values of

to JESD 51-7 and JESD 51-9 for detailed information on the

board construction.

calculation using a 4-layer board. The JESD51-12, Guidelines for

Reporting and Using Electronic Package Thermal Information,

states that thermal characterization parameters are not the same

through multiple thermal paths rather than a single path as in

convection from the top of the package as well as radiation from

Refer to JESD51-8 and JESD51-12 for more detailed information

THERMAL RESISTANCE

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

Unit

5-Lead TSOT

170

43

°C/W

6-Lead LFCSP

50.2

18.2

°C/W

4-Ball, 0.4 mm Pitch WLCSP

260

58

°C/W

ESD CAUTION

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