Data Sheet

ADP165/ADP166

NOTES

1. NC = NO CONNECT. NOT CONNECTED INTERNALLY.

2. THE EXPOSED PAD MUST BE CONNECTED TO

GROUND. THE EXPOSED PAD ENHANCES THE

THERMAL PERFORMANCE OF THE PACKAGE.

3

GND

1

VOUT

2

NC

4 EN

6 VIN

5 NC

ADP165/

ADP166

TOP VIEW

(Not to Scale)

Figure 6. 6-Lead LFCSP, Fixed Output Pin Configuration

Table 7. Fixed Output, 6-Lead LFCSP Pin Function Descriptions

Pin No.

Mnemonic

Description

1

VOUT

Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor.

2

NC

No Connect. This pin is not connected internally.

3

GND

Ground.

4

EN

Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup,

connect EN to VIN.

5

NC

No Connect. This pin is not connected internally. Connect this pin to GND or leave open.

6

VIN

Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.

EPAD

Exposed Pad. The exposed pad must be connected to ground. The exposed pad enhances the thermal

performance of the package.

3

GND

1

VOUT

2

ADJ

4 EN

6 VIN

5 NC

ADP165/

ADP166

TOP VIEW

(Not to Scale)

NOTES

1. NC = NO CONNECT. NOT CONNECTED INTERNALLY.

2. THE EXPOSED PAD MUST BE CONNECTED TO

GROUND. THE EXPOSED PAD ENHANCES THE

THERMAL PERFORMANCE OF THE PACKAGE.

Figure 7. 6-Lead LFCSP, Adjustable Output Pin Configuration

Table 8. Adjustable Output, 6-Lead LFCSP Pin Function Descriptions

Pin No.

Mnemonic

Description

1

VOUT

Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor.

2

ADJ

Output Voltage Adjust Pin. Connect the midpoint of the voltage divider between VOUT and GND to this pin to set

the output voltage.

3

GND

Ground.

4

EN

Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup,

connect EN to VIN.

5

NC

No Connect. This pin is not connected internally.

6

VIN

Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.

EPAD

Exposed Pad. The exposed pad must be connected to ground. The exposed pad enhances the thermal

performance of the package.

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