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STM8AF6213 数据表(PDF) 92 Page - STMicroelectronics |
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STM8AF6213 数据表(HTML) 92 Page - STMicroelectronics |
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92 / 112 page ![]() Package information STM8AF6213/13A/23/23A/26 92/112 DS9884 Rev 9 11 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 11.1 TSSOP20 package information Figure 42. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package outline 1. Drawing is not to scale. YA_ME_V3 1 20 C c L E E1 D A2 A k e b 10 11 A1 L1 aaa SEATING PLANE C GAUGE PLANE 0.25 mm PIN 1 IDENTIFICATION |
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