STPS3150 datasheet(5/16 Pages) STMICROELECTRONICS

5 / 16 page

Figure 7. Reverse leakage current versus reverse voltage

applied (typical values)

IR(µA)

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

100

125

150

V (V)

Tj = 125 °C

Tj = 150 °C

Tj = 100 °C

Tj = 50 °C

Tj = 25 °C

Tj = 75 °C

Figure 8. Junction capacitance versus reverse voltage

applied (typical values)

C(pF)

100

1000

1 0

100

1000

F = 1 MHZ

= 30 mV

OSC

RMS

Tj = 25 °C

V (V)

Figure 9. Forward voltage drop versus forward current

I (A)

100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

V (V)

Tj = 25 °C

(maximum values)

Tj = 125 °C

(typical values)

Tj = 125 °C

(maximum values)

Figure 10. Thermal resistance junction to ambient versus

copper surface under each lead (SMA Flat Notch)

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

SMA Flat Notch

Figure 11. Thermal resistance junction to ambient versus

copper surface under each lead (SMB)

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

SMB

S(Cu)(cm²)

Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm

Figure 12. Thermal resistance junction to ambient versus

copper surface under each lead (SMB flat)

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SCu(cm²)

Rth(j-a) (°C/W)

SMB flat

Epoxy printed circuit board FR4, e

Cu = 35 µm

STPS3150

Characteristics (curves)

DS3283 - Rev 7

page 5/16

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