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STPS3170 数据表(PDF) 5 Page - STMicroelectronics |
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STPS3170 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 13 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB Flat package information • Epoxy meets UL94, V0 • Lead-free package Figure 12. SMB Flat package outline D A L 2x L2 2 x L1 2 x E E1 b c Table 4. SMB Flat mechanical data Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 L1 0.40 0.016 L2 0.60 0.024 STPS3170 Package information DS10645 - Rev 2 page 5/13 |
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